參數(shù)資料
型號： EPF10K130EBC356-1
廠商： Altera
文件頁數(shù)： 43/100頁
文件大?。?/td> 0K
描述： IC FLEX 10KE FPGA 130K 356 BGA
產(chǎn)品培訓模塊： Three Reasons to Use FPGA's in Industrial Designs
標準包裝： 48
系列： FLEX-10KE®
LAB/CLB數(shù)： 832
邏輯元件/單元數(shù)： 6656
RAM 位總計： 65536
輸入/輸出數(shù)： 274
門數(shù)： 342000
電源電壓： 2.375 V ~ 2.625 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 356-BGA
供應(yīng)商設(shè)備封裝： 356-BGA（35x35）
Altera Corporation
47
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Generic Testing
Each FLEX 10KE device is functionally tested. Complete testing of each
configurable static random access memory (SRAM) bit and all logic
functionality ensures 100% yield. AC test measurements for FLEX 10KE
devices are made under conditions equivalent to those shown in
Figure 21. Multiple test patterns can be used to configure devices during
all stages of the production flow.
Figure 21. FLEX 10KE AC Test Conditions
Operating
Conditions
Tables 19 through 23 provide information on absolute maximum ratings,
recommended operating conditions, DC operating conditions, and
capacitance for 2.5-V FLEX 10KE devices.
Test
System
C1 (includes
JIG capacitance)
Device input
rise and fall
times < 3 ns
Device
Output
703
8.06 k
[481
]
[481
]
VCCIO
Power supply transients can affect AC
measurements. Simultaneous transitions of
multiple outputs should be avoided for
accurate measurement. Threshold tests
must not be performed under AC
conditions. Large-amplitude, fast-ground-
current transients normally occur as the
device outputs discharge the load
capacitances. When these transients flow
through the parasitic inductance between
the device ground pin and the test system
ground, significant reductions in
observable noise immunity can result.
Numbers in brackets are for 2.5-V devices
or outputs. Numbers without brackets are
for 3.3-V. devices or outputs.
Table 19. FLEX 10KE 2.5-V Device Absolute Maximum Ratings
Symbol
Parameter
Conditions
Min
Max
Unit
VCCINT
Supply voltage
With respect to ground (2)
–0.5
3.6
V
VCCIO
–0.5
4.6
V
VI
DC input voltage
–2.0
5.75
V
IOUT
DC output current, per pin
–25
25
mA
TSTG
Storage temperature
No bias
–65
150
° C
TAMB
Ambient temperature
Under bias
–65
135
° C
TJ
Junction temperature
PQFP, TQFP, BGA, and FineLine BGA
packages, under bias
135
° C
Ceramic PGA packages, under bias
150
° C
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K130EBC356-1X 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EBC356-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EBC356-2X 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EBC356-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EBC600-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 424 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
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