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    參數(shù)資料
    型號(hào): EPF10K100EFC484-1
    廠商: Altera
    文件頁數(shù): 32/100頁
    文件大小: 0K
    描述: IC FLEX 10KE FPGA 100K 484-FBGA
    產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
    標(biāo)準(zhǔn)包裝: 60
    系列: FLEX-10KE®
    LAB/CLB數(shù): 624
    邏輯元件/單元數(shù): 4992
    RAM 位總計(jì): 49152
    輸入/輸出數(shù): 338
    門數(shù): 257000
    電源電壓: 2.375 V ~ 2.625 V
    安裝類型: 表面貼裝
    工作溫度: 0°C ~ 85°C
    封裝/外殼: 484-BGA
    供應(yīng)商設(shè)備封裝: 484-FBGA(23x23)
    其它名稱: 544-1935
    EPF10K100EFC484-1-ND
    Altera Corporation
    37
    FLEX 10KE Embedded Programmable Logic Devices Data Sheet
    SameFrame
    Pin-Outs
    FLEX 10KE devices support the SameFrame pin-out feature for
    FineLine BGA packages. The SameFrame pin-out feature is the
    arrangement of balls on FineLine BGA packages such that the lower-ball-
    count packages form a subset of the higher-ball-count packages.
    SameFrame pin-outs provide the flexibility to migrate not only from
    device to device within the same package, but also from one package to
    another. A given printed circuit board (PCB) layout can support multiple
    device density/package combinations. For example, a single board layout
    can support a range of devices from an EPF10K30E device in a 256-pin
    FineLine BGA package to an EPF10K200S device in a 672-pin
    FineLine BGA package.
    The Altera software provides support to design PCBs with SameFrame
    pin-out devices. Devices can be defined for present and future use. The
    Altera software generates pin-outs describing how to lay out a board to
    take advantage of this migration (see Figure 18).
    Figure 18. SameFrame Pin-Out Example
    Designed for 672-Pin FineLine BGA Package
    Printed Circuit Board
    256-Pin FineLine BGA Package
    (Reduced I/O Count or
    Logic Requirements)
    672-Pin FineLine BGA Package
    (Increased I/O Count or
    Logic Requirements)
    100-Pin
    FineLine
    BGA
    256-Pin
    FineLine
    BGA
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    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    EPF10K100EFC484-1DX 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC
    EPF10K100EFC484-1N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 624 LABs 338 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
    EPF10K100EFC484-1X 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 624 LABs 338 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
    EPF10K100EFC484-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 624 LABs 338 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
    EPF10K100EFC484-2DX 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC