參數(shù)資料
型號(hào)： EMK12H2H-FREQTR
廠商： ECLIPTEK CORP
元件分類： XO, clock
英文描述： CRYSTAL OSCILLATOR, CLOCK, 1 MHz - 125 MHz, LVHCMOS OUTPUT
封裝： ROHS COMPLIANT, PLASTIC PACKAGE-4
文件頁(yè)數(shù)： 2/2頁(yè)
文件大?。?/td> 123K
代理商： EMK12H2H-FREQTR
MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV
.DATE
ECLIPTEK CORP.
OSCILLATOR
EMK12
PLASTIC
2.5V
OS5M
11/07
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
EMK12 H 2 H - 50.000M TR
PART NUMBERING GUIDE
AVAILABLE OPTIONS
Blank=Bulk
TR=Tape and Reel (Standard)
FREQUENCY
FREQUENCY TOLERANCE & STABILITY/
OPERATING TEMPERATURE RANGE
G=±100ppm Maximum over -40°C to +85°C
H=±50ppm Maximum over -40°C to +85°C
DUTY CYCLE
2=50% ±5%
LOGIC CONTROL
H=Tri-State (High Impedance)
J=Power Down (Logic Low)
A
B
C
D
E
F
16.0 ±0.3
7.5 ±0.2 6.75 ±0.2
4.0 ±0.2
2.0 ±0.2
F
G
H
J
K
L
8.0 ±0.2
A0*
1.5 ±0.1
B0* 0.30 ±0.05
K0*
TAPE
M
N
O
P
Q
1.5 MIN
50 MIN
20.2 MIN 13.0 ±0.2
40 MIN
R
S
T
U
V
QTY/REEL
2.5 MIN
10 MIN
22.4 MAX
180 MAX
16.4 +2/-0
1,000
REEL
*Compliant to EIA 481C
Tolerances= +0.1
2.00
(x4)
2.20
(x4)
1.81
2.88
MARKING SPECIFICATIONS
Pad 1: Tri-State or Power Down
Pad 2: Case Ground
Pad 3: Output
Pad 4: Supply Voltage
Line 1: XXXX
Ecliptek Manufacturing Lot Code
Characteristic
Specification
ESD Susceptibility
MIL-STD-883, Method 3015, Class 2, HBM: 2000V
Flammability
UL94-V0
Mechanical Shock
MIL-STD-883, Method 2002, Condition G, 30,000G
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity Level
J-STD-020, MSL 1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003 (Four I/O Pads on
bottom of package only)
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Thermal Shock
MIL-STD-883, Method 1011, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A, 20G
5.00
±0.15
7.00
±0.15
0.85 ±0.15
0.08
MAX
0.20
±0.10
2.60 ±0.15
1.40
±0.10 (x4)
1.20 ±0.10 (x4)
2.1
2
1
3
4
1.70
R0.70 ±0.10
5.08
±0.10
A
Note: Solder connection to the bottom
four I/O pads of the package only.
Note A: Center Paddle is No Connect.
C0.25 ±0.10
相關(guān)PDF資料
PDF描述
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