參數(shù)資料
型號: EL7564C
英文描述: Monolithic 4 Amp DC:DC Step-Down Converter(4A,單片DC:DC步降轉(zhuǎn)換器)
中文描述: 單片4安培直流:DC降壓轉(zhuǎn)換器(4A條,單片直流:直流步降轉(zhuǎn)換器)
文件頁數(shù): 3/17頁
文件大?。?/td> 342K
代理商: EL7564C
11
EL7564C
Monolithic 4 Amp DC:DC Buck Converter
EL
7564C
500mV hysteresis is present to eliminate noise-induced
oscillations.
Under-voltage and over-voltage conditions on the regu-
lator output are detected through an internal window
comparator. A logic high on the PG output indicates that
the regulated output voltage is within + 10% of the nom-
inal selected output voltage.
Thermal Management/Junction Temperature
The EL7564C utilizes "fused lead" packaging technol-
ogy in conjunction with the system board layout to
achieve a lower thermal resistance than typically found
in standard SO20 packages. By fusing (or connecting)
multiple external leads to the die substrate within the
package, a very conductive heat path is created to the
outside of the package. This conductive heat path MUST
then be connected to a heat sinking area on the PCB in
order to dissipate heat out and away from the device.
The conductive paths for the EL7564CM package are
the fused leads: # 6, 7, 11, 12, and 13. If a sufficient
amount of PCB metal area is connected to the fused
package leads, a junction-to-ambient resistance of
43°C/W can be achieved (compared to 85°C/W for a
standard SO20 package). The general relationship
between PCB heat-sinking metal area and the thermal
resistance for this package is shown in the Performance
Curves section of this data sheet. It can be readily seen
that the thermal resistance for this package approaches
an asymptotic value of approximately 43°C/W without
any airflow, and 33°C/W with 100 LFPM airflow. Addi-
tional information can be found in Application Note #8
(Measuring the Thermal Resistance of Power Surface-
Mount Packages). For a thermal shutdown die junction
temperature of 135°C, and power dissipation of 1.5W,
the ambient temperature can be as high as 70°C without
airflow. With 100 LFPM airflow, the ambient tempera-
ture can be extended to 85°C. Since the thermal
performance of the IC is heavily dependent on the board
layout, the system designer should exercise care during
the design phase to ensure that the IC will operate under
the worst-case environmental conditions.
Layout Considerations
The layout is very important for the converter to func-
tion properly. Power Ground ( ) and Signal Ground (---)
should be separated to ensure that the high pulse current
in the Power Ground never interferes with the sensitive
signals connected to Signal Ground. They should only
be connected at one point (normally at the negative side
of either the input or output capacitor.)
In addition, the bypass capacitor connected to the VS pin
needs to be as close to the pin as possible.
The heat of the chip is mainly dissipated through the
PGND pins. Maximizing the copper area around these
pins is preferable. In addition, a solid ground plane is
always helpful for the EMI performance.
Power Share
The EL7564C can be used in multiple units in parallel to
drive a large load. By connecting all the PSHR pins
together for every unit, the power delivery to the com-
mon load will be distributed according to the efficiencies
of each unit. The most efficient unit will deliver more
load current than the others. When all units are in equi-
librium, they will have the same power dissipation even
though the current load is not equally distributed among
the units. Please see refer to the application note using
the power sharing function of EL7564C/63C for detailed
diagram and performance.
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