12
EL7558BC
Integrated Adjustable 8 Amp Synchronous Switcher
E
L
75
58
B
C
exceeds the thermal trip-point, the OT pin will output a
logic 0. The upper and lower trip points are set to 135 C
and 100C respectively. To enable thermal shutdown
this pin should be tied directly to OUTEN. Use of this
feature is recommended during normal operation
Power Good and Power On Reset
During power up the output regulator will be disabled
until VIN reaches 4.0V. Approximately 500mV of hys-
teresis is present to eliminate noise induced oscillations.
Under-voltage and over-voltage conditions on the regu-
lator output are detected through an internal window
comparator. A logic 1 on the PWRGD output indicates
that regulated output voltage is within ±10% of the nom-
inally programmed output voltage. Although small, the
typical values of the PWRGD threshold will vary with
changes to external feedback (and resultant loop gain) of
the system. This dependence is shown in the typical per-
formance curves.
Thermal Management
The EL7558BC utilizes HSOP packaging technology in
conjunction with the system board layout to achieve a
lower thermal resistance than typically found in standard
28 lead SOIC packages. By attaching the die directly to
an exposed metal slug embedded within the package
body, thermal energy flows through a thermally conduc-
tive path (metal) instead of thermally resistive plastic.
After conducting heat from the die to the PCB, heat
transfer occurs by convection. If a significant amount of
metal on the PCB is connected to the exposed heat slug,
a junction-to-ambient resistance of 31C/W can be
achieved compared to 100C/W found in standard pack-
ages. It can be readily seen that the thermal resistance
approaches an asymptotic value of approximately
31C/W. Additional information can be found in Appli-
cation Note #8 (Measuring the Thermal Resistance of
Power Surface-Mount Packages), and Application Note
#13 (EL75XX Thermal Design Considerations).
If the thermal shutdown pin is connected to OUTEN the
IC will enter thermal shutdown when the maximum
junction temperature is reached. For a thermal shutdown
of 135C and power dissipation of 2.2W the ambient
temperature is limited to a maximum value of 67C (typ-
ical). The ambient temperature range can be extended
with the application of air flow. For example, the addi-
tion of 100LFM reduces the thermal resistance by
approximately 15% and can extend the operating ambi-
ent to 77C (typical). Since the thermal performance of
the IC is heavily dependent on the board layout, the sys-
tem designer should exercise care during the design
phase to ensure that the IC will operate under the worst-
case environmental conditions.