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參數(shù)資料
| 型號： | EH5745TTS-3.6864MTR |
| 廠商： | ECLIPTEK CORP |
| 元件分類： | XO, clock |
| 英文描述： | CRYSTAL OSCILLATOR, CLOCK, 3.6864 MHz, LVCMOS OUTPUT |
| 封裝： | ROHS COMPLIANT, CERAMIC, SMD, 4 PIN |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 103K |
| 代理商： | EH5745TTS-3.6864MTR |
MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV
.DATE
ECLIPTEK CORP.
OSCILLATOR
EH57
CERAMIC
2.5V
OS6Z
09/09
EH57 00 ET T TS - 24.000M TR
FREQUENCY TOLERANCE / STABILITY
00=±100ppm Maximum, 45=±50ppm Maximum,
25=±25ppm Maximum, 20=±20ppm Maximum
OPERATING TEMP. RANGE
Blank =0C to 70C
ET=-40°C to 85°C
DUTY CYCLE
Blank=50 ±10(%)
T=50 ±5(%)
PART NUMBERING GUIDE
*Compliant to EIA 481A
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
Tolerances= +0.1
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
0.425
0.725
0.8 (X4)
0.9
(X4)
MARKING
ORIENT
A
TION
2.50
±0.15
2.00
±0.15
0.90 ±0.10
0.675 ±0.10
0.95
±0.10
0.65±0.10
0.775
±0.10
1
23
4
Pin 1: Tri-State
Pin 2: Case Ground
Pin 3: Output
Pin 4: Supply Voltage
AVAILABLE OPTIONS
Blank=Bulk
TR=Tape & Reel
FREQUENCY
OUTPUT CONTROL FUNCTION
TS=Tri-State
M
N
O
P
Q
1.5 MIN
50 MIN
20.2 MIN
13±2-.2
40 MIN
R
S
T
U
V
QTY/REEL
2.5 MIN
10 MIN
14.4 MAX
360 MAX
8.4+1.5-0
1,000
REEL
A
B
C
D
E
F
8.0 ±.2
3.5±.1
2.75±.1
4 ±.1
2±.1
F
G
H
J
K
L
4±.1
B0*
1.55 ±.05
A0*
.25 ±.05
K0*
REEL
Line 1: EPO
Line 2: XXXXX
Ecliptek Manufacturing Identifier
Characteristic
Specification
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Flammability
UL94-V0
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Mechanical Shock
MIL-STD-883, Method 2002, Condition B
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity
J-STD-020, MSL 1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A
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