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參數(shù)資料
| 型號： | ECP103G-PCB2650 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 1 Watt, High Linearity InGaP HBT Amplifier |
| 中文描述： | 1瓦特，高線性InGaP HBT功率放大器 |
| 文件頁數(shù)： | 4/5頁 |
| 文件大?。?/td> | 382K |
| 代理商： | ECP103G-PCB2650 |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
October 2004 Rev 1
ECP103
1 Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
ECP103G (SOIC-8 Package) Mechanical Information
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 C. Tjc is a function
of the voltage at pins 6 and 7 and the current applied to
pins 6, 7, and 8 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
450 mA at an 85 C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247 C.
Rating
-40 to +85
q
C
33
q
C / W
159
q
C
Product Marking
The component will be marked with an
“ECP103G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
MSL Rating: Level 3 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Diagram
2
3
4
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Function
Vref
Input
Output
Vbias
GND
N/C or GND
Pin No.
1
3
6, 7
8
Backside Paddle
2, 4, 5
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
2.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
3. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
5. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8
All dimensions are in millimeters (inches). Angles are in
degrees.
1
8
7
6
5
MTTF vs. GND Tab Temperature
100
1000
10000
100000
1000000
50
60
70
80
90
100
Tab temperature (°C)
M
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