參數(shù)資料
型號: DSPIC33FJ12MC202-I/SS
廠商: Microchip Technology
文件頁數(shù): 31/155頁
文件大?。?/td> 0K
描述: IC DSPIC MCU/DSP 12K 28SSOP
產(chǎn)品培訓模塊: Asynchronous Stimulus
特色產(chǎn)品: PIC24FJ/33FJ MCUs & dsPIC? DSCs
標準包裝: 47
系列: dsPIC™ 33F
核心處理器: dsPIC
芯體尺寸: 16-位
速度: 40 MIP
連通性: I²C,IrDA,SPI,UART/USART
外圍設備: 高級欠壓探測/復位,電機控制 PWM,QEI,POR,PWM,WDT
輸入/輸出數(shù): 21
程序存儲器容量: 12KB(12K x 8)
程序存儲器類型: 閃存
RAM 容量: 1K x 8
電壓 - 電源 (Vcc/Vdd): 3 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 6x10b/12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 28-SSOP(0.209",5.30mm 寬)
包裝: 管件
產(chǎn)品目錄頁面: 651 (CN2011-ZH PDF)
2007-2011 Microchip Technology Inc.
DS70265E-page 17
dsPIC33FJ12MC201/202
2.5
ICSP Pins
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming (ICSP) and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternately, refer to the AC/DC characteristics and tim-
ing requirements information in the respective device
Flash programming specification for information on
capacitive loading limits and pin input voltage high (VIH)
and input low (VIL) requirements.
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB ICD 2, MPLAB ICD 3, or MPLAB REAL
ICE.
For more information on ICD 2, ICD 3, and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site.
“MPLAB ICD 2 In-Circuit Debugger User’s
Guide”
DS51331
“Using MPLAB ICD 2” (poster) DS51265
“MPLAB ICD 2 Design Advisory” DS51566
“Using MPLAB ICD 3” (poster) DS51765
“MPLAB ICD 3 Design Advisory” DS51764
“MPLAB REAL ICE In-Circuit Debugger
User’s Guide”
DS51616
“Using MPLAB REAL ICE” (poster) DS51749
2.6
External Oscillator Pins
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 8.0 “Oscillator
for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in Figure 2-3.
FIGURE 2-3:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
13
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
14
15
16
17
18
19
20
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