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參數(shù)資料
| 型號： | DS90LV804TSQ/NOPB |
| 廠商： | National Semiconductor |
| 文件頁數(shù)： | 14/15頁 |
| 文件大小： | 0K |
| 描述： | IC BUFF REPEATER LVDS 4CH 32LLP |
| 產(chǎn)品培訓(xùn)模塊： | High Speed LVDS |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 類型： | 緩沖器 |
| Tx/Rx類型： | LVDS |
| 延遲時(shí)間： | 3.2ns |
| 電容 - 輸入： | 3.5pF |
| 電源電壓： | 3.15 V ~ 3.45 V |
| 電流 - 電源： | 140mA |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-WFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 32-LLP-EP（5x5） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁面： | 1280 (CN2011-ZH PDF) |
| 其它名稱： | DS90LV804TSQDKR |
PO
W
ER
SU
PPL
Y
C
U
R
EN
T
(mA)
350
0
BIT DATA RATE (Gbps)
50
100
150
200
250
300
PRBS-23
Clock
0
0.25
0.5
0.75
1.0
SNLS195L – SEPTEMBER 2005 – REVISED APRIL 2013
Typical Performance Characteristics
A. Dynamic power supply current was measured while running a clock or PRBS 223-1 pattern with all 4 channels active. VCC = 3.3V, TA =
+25°C, VID = 0.5V, VCM = 1.2V
Figure 6. Power Supply Current vs Bit Data Rate
PACKAGING INFORMATION
The Leadless Leadframe Package (WQFN) is a leadframe based chip scale package (CSP) that may enhance
chip speed, reduce thermal impedance, and reduce the printed circuit board area required for mounting. The
small size and very low profile make this package ideal for high density PCBs used in small-scale electronic
applications such as cellular phones, pagers, and handheld PDAs. The WQFN package is offered in the no
Pullback configuration. In the no Pullback configuration the standard solder pads extend and terminate at the
edge of the package. This feature offers a visible solder fillet after board mounting.
The WQFN has the following advantages:
Low thermal resistance
Reduced electrical parasitics
Improved board space efficiency
Reduced package height
Reduced package mass
For more details about WQFN packaging technology, refer to applications note AN-1187, "Leadless Leadframe
Package".
8
Copyright 2005–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV804
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