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參數(shù)資料
| 型號： | DS90CR218AMTD/NOPB |
| 廠商： | National Semiconductor |
| 文件頁數(shù)： | 5/18頁 |
| 文件大小： | 0K |
| 描述： | IC RCVR 21BIT CHAN LINK 48TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | Interconnect Solutions for LVDS Applications |
| 標(biāo)準(zhǔn)包裝： | 38 |
| 類型： | 接收器 |
| 驅(qū)動(dòng)器/接收器數(shù)： | 21/21 |
| 規(guī)程： | LVDS |
| 電源電壓： | 3 V ~ 3.6 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 48-TFSOP（0.240"，6.10mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 48-TSSOP |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁面： | 1280 (CN2011-ZH PDF) |
| 其它名稱： | *DS90CR218AMTD *DS90CR218AMTD/NOPB DS90CR218AMTD |
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
DS90CR217MTD
NRND
TSSOP
DGG
48
38
TBD
Call TI
-10 to 70
DS90CR217MTD
>B
DS90CR217MTD/NOPB
ACTIVE
TSSOP
DGG
48
38
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-10 to 70
DS90CR217MTD
>B
DS90CR217MTDX/NOPB
ACTIVE
TSSOP
DGG
48
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-10 to 70
DS90CR217MTD
>B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS90CR218AMTDX | 功能描述:串行器/解串器 - Serdes RoHS:否 制造商:Texas Instruments 類型:Deserializer 數(shù)據(jù)速率:1.485 Gbit/s 輸入類型:ECL/LVDS 輸出類型:LVCMOS 輸入端數(shù)量:1 輸出端數(shù)量:20 工作電源電壓:2.375 V to 2.625 V 工作溫度范圍:0 C to + 70 C 封裝 / 箱體:TQFP-64 |
| DS90CR218AMTDX/NOPB | 功能描述:LVDS 接口集成電路 RoHS:否 制造商:Texas Instruments 激勵(lì)器數(shù)量:4 接收機(jī)數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel |
| DS90CR218MTD | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:+3.3V Rising Edge Data Strobe LVDS 21-Bit Channel Link - 75 MHz |
| DS90CR218MTD/NOPB | 功能描述:IC RCVR 21BIT CHAN LINK 48TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 類型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
| DS90CR218MTDX | 功能描述:IC RCVR 21BIT CHAN LINK 48TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 類型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
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