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40V, Ultra-Low Quiescent-Current
Linear Regulators in 6-Pin TDFN/8-Pin SO
2
Maxim Integrated
MAX15006/MAX15007
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = 14V, IOUT = 1mA, CIN = 0.1F, COUT = 2.2F, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical specifications are at
TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
IN to GND ...............................................................-0.3V to +45V
EN to GND..............................................................-0.3V to +45V
OUT, FB to GND.....................................................-0.3V to +12V
OUT Short-Circuit Duration ........................................Continuous
Maximum Current Into Any Pin (except IN and OUT) ......±50mA
Continuous Power Dissipation (TA = +70°C)
TDFN (derate 23.8mW/°C above +70°C) ........................1904mW
SO (derate 23.3mW/°C above +70°C)..........................1860mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (
θJA) ...........42°C/W
Junction-to-Case Thermal Resistance (
θJC) ...............8.5°C/W
SO
Junction-to-Ambient Thermal Resistance (
θJA) ...........43°C/W
Junction-to-Case Thermal Resistance (
θJC) ..................7°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input Voltage Range
VIN
4
40
V
IOUT = 0A (MAX15006A/B/D)
10
17
IOUT = 0A (MAX15006C)
8
15
IOUT = 0A (MAX15007A/B)
11
18
IOUT = 0A (MAX15007C)
9
16
IOUT = 100μA
(MAX15006A/B/D)
10.5
18
IOUT = 100μA (MAX15006C)
8.5
16
IOUT = 100μA (MAX15007A/B)
11.5
19
IOUT = 100μA (MAX15007C)
9.5
17
IOUT = 1mA (MAX15006A/B/D)
12
20
IOUT = 1mA (MAX15006C)
10
18
IOUT = 1mA (MAX15007A/B)
13
21
IOUT = 1mA (MAX15007C)
11
19
IOUT = 50mA (MAX15006)
90
150
IOUT = 50mA (MAX15007)
93
150
Ground Current
IGND
Regulator on,
measured at GND
IOUT = 60mA (MAX15006D)
110
150
μA
Shutdown Supply Current
ISHDN
Regulator off (MAX15007 only)
3
5
μA