參數(shù)資料
型號(hào): DS21Q552N+
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 4/13頁(yè)
文件大?。?/td> 0K
描述: IC TXRX T1 QUAD 5V 256BGA
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 40
功能: 收發(fā)器
接口: T1
電路數(shù): 4
電源電壓: 5V
安裝類型: 表面貼裝
封裝/外殼: 256-BBGA
供應(yīng)商設(shè)備封裝: 256-BGA(27x27)
包裝: 管件
包括: 警報(bào)檢測(cè)和生成,通道控制,調(diào)幀器,HDLC 控制器
DALLAS SEMICONDUCTOR
DS21Q352/DS21Q552/DS21Q354/DS21Q554 Preliminary Data Sheet
December 29, 1998
12
POWER SUPPLY DE-COUPLING
In a typical PCB layout for the DS21x5y, all of the VDD pins will connect to a common power plane and all
the VSS lines will connect to a common ground plane. There are three recommended methods for de-
coupling shown below in both schematic and pictorial form. As shown in the pictorials, the capacitors
should be symmetrically located about the device. The first shown in figure 3 uses standard capacitors,
two 33uf tantalums, two .33uf ceramics and two .01uf ceramics. The second method shown in figure 4
uses a single 68uf tantalum, two .33uf ceramics and two .01uf ceramics. The third method shown in figure
5 uses only four capacitors, two 1.5uf MLC and two .01uf ceramics. The 1.5uf is an MLC (Multi Layer
Ceramic) type. The MLC construction is a low inductance type, which allows a smaller value of
capacitance to be used. Since VDD and VSS signals will typically pass vertically to the power and ground
planes of a PCB, the de-coupling caps must be placed as close to the DS21Qx5y as possible and routed
vertically to power and ground planes.
De-coupling scheme using standard tantalum caps. Figure 3
De-coupling scheme using single 68uf cap. Figure 4
De-coupling scheme using MCL caps. Figure 5
All capacitor values in figures 3, 4 and 5 are in uf.
33
.33
.01
33
.33
.01
VDD
DS21Qx5y
.01
.33
33
DS21Qx5y
.01
VDD
DS21Qx5y
1.5
.01
1.5
DS21Qx5y
.33
.01
.33
VDD
DS21Qx5y
68
.01
.33
68
DS21Qx5y
相關(guān)PDF資料
PDF描述
MC9S08DN16AMLF IC MCU 16K FLASH 1K RAM 48LQFP
S9S08DV16F1MLC IC MCU 8BIT 16KB FLASH 32LQFP
MC9S08AW48CPUE IC MCU 48K FLASH 64-LQFP
MC9S08AW48CFUE IC MCU 48K FLASH 64-QFP
DS21Q354BN+ IC TXRX QUAD E1 3.3V 256-BGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS21Q552N+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 5V Quad T1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21Q552N-C01 制造商:Maxim Integrated Products 功能描述:DS21Q552 RCV LVL SCR - Rail/Tube
DS21Q554 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21Q554B 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21Q554B+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray