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參數(shù)資料
| 型號： | DS1315E-5 |
| 廠商： | DALLAS SEMICONDUCTOR |
| 元件分類： | Timer or RTC |
| 英文描述： | 0 TIMER(S), REAL TIME CLOCK, PDSO20 |
| 封裝： | TSSOP-20 |
| 文件頁數(shù)： | 17/21頁 |
| 文件大?。?/td> | 523K |
| 代理商： | DS1315E-5 |
DS1315
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NONVOLATILE CONTROLLER OPERATION
The operation of the nonvolatile controller circuits within the Time Chip is determined by the level of the
ROM/ RAM select pin. When ROM/ RAM is connected to ground, the controller is set in the RAM mode
and performs the circuit functions required to make CMOS RAM and the timekeeping function
nonvolatile. A switch is provided to direct power from the battery inputs or VCCI to VCCO with a
maximum voltage drop of 0.3 volts. The VCCO output pin is used to supply uninterrupted power to CMOS
SRAM. The DS1315 also performs redundant battery control for high reliability. On power-fail, the
battery with the highest voltage is automatically switched to VCCO. If only one battery is used in the
system, the unused battery input should be connected to ground.
The DS1315 safeguards the Time Chip and RAM data by power-fail detection and write protection.
Power-fail detection occurs when VCCI falls below VPF which is set by an internal bandgap reference. The
DS1315 constantly monitors the VCCI supply pin. When VCCI is less than VPF, power-fail circuitry forces
the chip enable output ( CEO ) to VCCI or VBAT-0.2 volts for external RAM write protection. During
nominal supply conditions, CEO will track CEI with a propagation delay. Internally, the DS1315 aborts
any data transfer in progress without changing any of the Time Chip registers and prevents future access
until VCCI exceeds VPF. A typical RAM/Time Chip interface is illustrated in Figure 3.
When the ROM/ RAM pin is connected to VCCO, the controller is set in the ROM mode. Since ROM is a
read-only device that retains data in the absence of power, battery backup and write protection is not
required. As a result, the chip enable logic will force CEO low when power fails. However, the Time
Chip does retain the same internal nonvolatility and write protection as described in the RAM mode. A
typical ROM/Time Chip interface is illustrated in Figure 4.
DS1315 TO RAM/TIME CHIP INTERFACE Figure 3
相關PDF資料 |
PDF描述 |
|---|---|
| DS1315SN-33 | 0 TIMER(S), REAL TIME CLOCK, PDSO16 |
| DS1330ABP-100 | 32K X 8 NON-VOLATILE SRAM MODULE, 100 ns, DMA34 |
| DS1330YP-100 | 32K X 8 NON-VOLATILE SRAM MODULE, 100 ns, DMA34 |
| DS1330ABP-70 | 32K X 8 NON-VOLATILE SRAM MODULE, 70 ns, DMA34 |
| DS1330WP-150 | 32K X 8 NON-VOLATILE SRAM MODULE, 150 ns, DMA34 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| DS1315E-5+ | 功能描述:實時時鐘 Phantom Time Chip RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1315E-5V | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Real-Time Clock |
| DS1315EN-33 | 功能描述:實時時鐘 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1315EN-33/R | 制造商:DALLAS 制造商全稱:Dallas Semiconductor 功能描述:Phantom Time Chip |
| DS1315EN-33/T | 制造商:DALLAS 制造商全稱:Dallas Semiconductor 功能描述:Phantom Time Chip |
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