參數(shù)資料
型號(hào): DS1314S+
廠(chǎng)商: Maxim Integrated
文件頁(yè)數(shù): 8/12頁(yè)
文件大?。?/td> 0K
描述: IC CTRLR NV W/BATT MON 3V 16SOIC
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 45
控制器類(lèi)型: 非易失性 RAM
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 16-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC W
包裝: 管件
DS1314
5 of 12
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground
-0.5V to +6.0V
Operating Temperature Range
-40°C to +85°C
Storage Temperature Range
-55°C to +125°C
Soldering Temperature (reflow, SO or TSSOP)
+260°C
Lead Temperature (soldering, 10s)
+300°C
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of
time may affect reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PDIP
Junction-to-Ambient Thermal Resistance (θJA).…………………...………………………....110°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………40°C/W
8 SO
Junction-to-Ambient Thermal Resistance (θJA).……………………………………………...132°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………38°C/W
16 SO
Junction-to-Ambient Thermal Resistance (θJA).…………………...………………………......71°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………23°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θJA).……………………………………………..73.8°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………20°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board for the SMT packages. For detailed information on package thermal considerations, refer to
RECOMMENDED OPERATING CONDITIONS
(-40°C to +85°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Supply Voltage TOL=GND
VCCI
3.0
3.3
3.6
V
2
Supply Voltage TOL=VCCO
VCCI
2.7
3.0
3.3
V
2
Battery Supply Voltage
VBAT
2.0
6.0
V
2
Logic 1 Input
VIH
2.0
VCCI+0.3
V
2, 13
Logic 0 Input
VIL
-0.3
+0.8
V
2, 13
DC ELECTRICAL CHARACTERISTICS
(-40°C to +85°C; VCCI = ≥VCCTP)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Operating Current (TTL inputs)
ICC1
50
200
A
3
Operating Current (CMOS inputs)
ICC2
30
100
A
3, 6
RAM Supply Current
(VCCO ≥ VCCI -0.2V)
ICCO1
80
mA
4
RAM Supply Current
(VCCO ≥ VCCI -0.3V)
ICCO1
140
mA
5
VCC Trip Point (TOL=GND)
VCCTP
2.8
2.9
3.0
V
2
VCC Trip Point (TOL=VCCO)
VCCTP
2.5
2.6
2.7
V
2
相關(guān)PDF資料
PDF描述
RBB25DHHN CONN EDGE DUAL .050 DIP 50 POS
DS1312S-2+ IC CTRLR NV W/BATT MOD 8-SOIC
GRM1885C2A161JA01D CAP CER 160PF 100V 5% NP0 0603
DS1321S+ IC CTRLR NV W/BATT MON 5V 16SOIC
DS1321+ IC CTRLR NV W/BATT MON 5V 16-DIP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS1314S/T&R 制造商:Maxim Integrated Products 功能描述:NV CONTRL 3V BW&RST 16-SOIC T&R - Tape and Reel 制造商:Maxim Integrated Products 功能描述:IC CTRLR NV W/BATT MON 3V 16SOIC
DS1314S/T&R/C03 制造商:Maxim Integrated Products 功能描述:NV CONTRL 3V BW&RST 16P SOIC TR IBM - Tape and Reel
DS1314S/T&R 功能描述:IC CTRLR NV W/BATT MON 3V 16SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:45 系列:- 控制器類(lèi)型:靜態(tài) RAM(SRAM) 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 封裝/外殼:16-SOIC(0.295",7.50mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC W 包裝:管件
DS1314S+ 功能描述:存儲(chǔ)器控制器 3V Cntlr w/Lithium Battery Monitor RoHS:否 制造商:Maxim Integrated
DS1314S+T&R 制造商:Maxim Integrated Products 功能描述:NONVOLATILE CNTRLR W/ LITHIUM BATTERY MONITOR 16SOIC - Tape and Reel 制造商:Maxim Integrated Products 功能描述:IC CTRLR NV W/BATT MON 3V 16SOIC 制造商:Maxim Integrated Products 功能描述:Memory Controllers 3V Cntlr w/Lithium Battery Monitor