參數(shù)資料
型號(hào): DS1312S-2/T&R
廠商: Maxim Integrated
文件頁(yè)數(shù): 8/12頁(yè)
文件大?。?/td> 0K
描述: IC CONTROLLER NV BW/RST 8-SOIC
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
控制器類(lèi)型: 非易失性 RAM
電源電壓: 4.75 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOIC
包裝: 帶卷 (TR)
DS1312
5 of 12
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground
-0.5V to +6.0V
Operating Temperature Range
-40°C to +85°C
Storage Temperature Range
-55°C to +125°C
Soldering Temperature (reflow, SO or TSSOP)
+260°C
Lead Temperature (soldering, 10s)
+300°C
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of
time may affect reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PDIP
Junction-to-Ambient Thermal Resistance (θJA).…………………...………………………....110°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………40°C/W
8 SO
Junction-to-Ambient Thermal Resistance (θJA).……………………………………………...132°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………38°C/W
16 SO
Junction-to-Ambient Thermal Resistance (θJA).…………………...………………………......71°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………23°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θJA).……………………………………………..73.8°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………20°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board for the SMT packages. For detailed information on package thermal considerations, refer to
RECOMMENDED OPERATING CONDITIONS
(-40°C to +85°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Supply Voltage TOL=GND
VCCI
4.75
5.0
5.5
V
2
Supply Voltage TOL=VCCO
VCCI
4.5
5.0
5.5
V
2
Battery Supply Voltage
VBAT
2.0
6.0
V
2
Logic 1 Input
VIH
2.0
VCCI+0.3
V
2, 13
Logic 0 Input
VIL
-0.3
+0.8
V
2, 13
DC ELECTRICAL CHARACTERISTICS
(-40°C to +85°C; VCCI >VCCTP)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Operating Current (TTL inputs)
ICC1
200
400
A
3
Operating Current (CMOS inputs)
ICC2
50
100
A
3, 6
RAM Supply Current
(VCCO ≥ VCCI -0.2V)
ICCO1
140
mA
4
RAM Supply Current
(VCCO ≥ VCCI -0.3V)
ICCO1
200
mA
5
VCC Trip Point (TOL=GND)
VCCTP
4.50
4.62
4.75
V
2
VCC Trip Point (TOL=VCCO)
VCCTP
4.25
4.37
4.50
V
2
VBAT Trip Point
VBTP
2.5
2.6
2.7
V
2
相關(guān)PDF資料
PDF描述
T86D107K6R3EBAL CAP TANT 100UF 6.3V 10% 2917
VE-B34-EU-B1 CONVERTER MOD DC/DC 48V 200W
VI-BNP-CV-S CONVERTER MOD DC/DC 13.8V 150W
ISL6416IAZ-TK IC REG LDO 1.8V/2.8V/2.8V 16QSOP
T86D686M6R3EBAL CAP TANT 68UF 6.3V 20% 2917
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS-1313HZ-B 制造商:Hikvision USA 功能描述:Box Camera Housing with Wall Bracket and Fan/Heater 制造商:HIKVISION 功能描述:BOX CAMERA HOUSING +FAN/HTR INCLUDES DS-1213ZJ WALL BRACKE
DS1314 功能描述:IC CTRLR NV W/BATT MON 3V 8-DIP RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:45 系列:- 控制器類(lèi)型:靜態(tài) RAM(SRAM) 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 封裝/外殼:16-SOIC(0.295",7.50mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC W 包裝:管件
DS1314_05 制造商:DALLAS 制造商全稱(chēng):Dallas Semiconductor 功能描述:3V Nonvolatile Controller with Lithium Battery Monitor
DS1314+ 功能描述:IC CTRLR NV W/BATT MON 8-DIP RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:45 系列:- 控制器類(lèi)型:靜態(tài) RAM(SRAM) 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 封裝/外殼:16-SOIC(0.295",7.50mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC W 包裝:管件
DS1314E 功能描述:IC CTRL NV W/BATT MON 3V 20TSSOP RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:45 系列:- 控制器類(lèi)型:靜態(tài) RAM(SRAM) 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 封裝/外殼:16-SOIC(0.295",7.50mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC W 包裝:管件