Low-Current I2C RTC with 56-Byte NV RAM 9 Maxim Integrated Freshness Seal" />
參數(shù)資料
型號: DS1308U-18+
廠商: Maxim Integrated Products
文件頁數(shù): 16/16頁
文件大?。?/td> 0K
描述: IC RTC 56BYTE NVRAM I2C 8UMAX
標準包裝: 50
類型: 時鐘/日歷
特點: 閏年,NVSRAM,方波輸出
存儲容量: 56B
時間格式: HH:MM:SS(12/24 小時)
數(shù)據(jù)格式: YY-MM-DD-dd
接口: I²C,2 線串口
電源電壓: 1.71 V ~ 5.5 V
電壓 - 電源,電池: 1.3 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應商設(shè)備封裝: 8-uMAX
包裝: 管件
DS1308
Low-Current I2C RTC with 56-Byte NV RAM
9
Maxim Integrated
Freshness Seal Mode
When a battery is first attached to the device, the device
does not immediately provide battery-backup power to
the RTC or internal circuitry. After VCC exceeds VPF,
the devices leave the freshness seal mode and provide
battery-backup power whenever VCC subsequently falls
below VBAT. This mode allows attachment of the battery
during product manufacturing, but no battery capacity is
consumed until after the system has been activated for
the first time. As a result, minimum battery energy is used
during storage and shipping.
Oscillator Circuit
The DS1308 uses an external 6pF 32.768kHz crystal. The
oscillator circuit does not require any external resistors or
capacitors to operate. See Table 2 for the external crystal
parameters. The Functional Diagram shows a simplified
schematic of the oscillator circuit. The startup time is
usually less than 1 second when using a crystal with the
specified characteristics.
Whenever VCC > VPF, a 5Fs glitch filter at the output of
the crystal oscillator is enabled.
Clock Accuracy
The accuracy of the clock is dependent upon the
accuracy of the crystal and the accuracy of the match
between the capacitive load of the oscillator circuit and
the capacitive load for which the crystal was trimmed.
Crystal frequency drift caused by temperature shifts
creates additional error. External circuit noise coupled
into the oscillator circuit can result in the clock running
fast. Figure 3 shows a typical PCB layout for isolating
the crystal and oscillator from noise. Refer to Application
Note 58: Crystal Considerations with Maxim Real-Time
Clocks (RTCs) for detailed information.
Table 1. Power Control
Table 2. Crystal Specifications
Note: The crystal, traces, and crystal input pins should be isolated from RF generat-
Clocks (RTCs) for additional specifications.
Figure 3. Typical PCB Layout for Crystal
SUPPLY CONDITION
READ/WRITE
ACCESS
POWERED
BY
VCC < VPF, VCC < VBAT
No
VBAT
VCC < VPF, VCC > VBAT
No
VCC
VCC > VPF, VCC < VBAT
Yes
VCC
VCC > VPF, VCC > VBAT
Yes
VCC
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
Nominal Frequency
fO
32.768
kHz
Series Resistance
ESR
100
kI
Load Capacitance
CL
6
pF
CRYSTAL
X1
X2
GND
LOCAL GROUND PLANE (LAYER 2)
NOTE: AVOID ROUTING SIGNALS IN THE CROSSHATCHED AREA (UPPER LEFT-HAND
QUADRANT) OF THE PACKAGE UNLESS THERE IS A GROUND PLANE BETWEEN THE
SIGNAL LINE AND THE PACKAGE.
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