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參數(shù)資料
| 型號： | DPS2ME16MKI3-25M |
| 廠商： | TWILIGHT TECHNOLOGY INC |
| 元件分類： | SRAM |
| 英文描述： | 2M X 16 MULTI DEVICE SRAM MODULE, 25 ns, QMA52 |
| 文件頁數(shù)： | 1/8頁 |
| 文件大?。?/td> | 498K |
| 代理商： | DPS2ME16MKI3-25M |
32 Megabit High Speed CMOS SRAM
DPS2ME16MKn3
DESCRIPTION:
The DPS2ME16MKn3 High Speed SRAM ‘’STACK’’ modules are a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded
packages. The module packs 32-Megabits of low-power CMOS
static RAM in an area as small as 0.549 in2, while maintaining a
total height as low as 0.545 inches.
The DPS2ME16MKn3 STACK modules contain eight individual
512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,
making the modules suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
FEATURES:
Organizations Available:
2 Meg x 16 or 4 Meg x 8
Access Times:
20*, 25, 30, 35, 45ns
Fully Static Operation - No clock or refresh required
Single +5V Power Supply,
±10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage:
2.0V min.
Packages Available:
SLCC Stack
Straight Leaded Stack
‘’J’’ Leaded Stack
Gullwing Leaded Stack
* Commercial and Industrial Grade only.
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
A0 - A18
Address Inputs
I/O0 - I/O15
Data Input/Output
CE0 - CE3
Low Chip Enables
WE0, WE1
Write Enables
OE0, OE1
Output Enables
VDD
Power (+5V)
VSS
Ground
N.C.
No Connect
2Mx16, 20 - 45ns, STACK
30A129-28
B
SLCC Stack
Straight
Leaded
Stack
Gullwing
Leaded
Stack
‘’J’’ Leaded
Stack
This document contains information on a product presently under
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right
to change products or specifications herein without prior notice.
30A129-28
REV. B
1
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