![](http://datasheet.mmic.net.cn/210000/DPAF-04-03-0-H-3-2-A_datasheet_15429238/DPAF-04-03-0-H-3-2-A_1.png)
(2,16mm) .085"
DPAM, DPAF SERIES
HIGH DENSITY DIFFERENTIAL PAIR ARRAY
DPAF–23–03.0–H–8–2–A
DPAM–23–07.0–H–8–2–A
WWW.SAMTEC.COM
DPAM Mates with:
DPAF, RDPAF
DPAF Mates with:
DPAM
For complete specifications and
recommended PCB layouts see
www.samtec.comDPAM or
www.samtec.comDPAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au over 50μ" (1,27μm) Ni
Current Rating (2x3):
2.9A @ 30°C Temperature Rise
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
10.4m
Ω
max
Working Voltage:
300 VAC
Mated Cycles:
100 Cycles
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
ALSO
AVAILABLE
Tin-Lead Solder Charge.
Call Samtec.
F-211
SPECIFICATIONS
Note:
Other Gold plating
options available.
Contact Samtec.
PAIRS
PER ROW
OPTION
DPAM
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
LEAD
STYLE
A
–04, –06
(–07.0 only)
–08, –15, –23
(All lead styles)
–8
=Eight
Pair
Rows
–3
=Three
Pair
Rows
(–07 only)
–2
= Lead-Free
Tin Alloy
96.5% Sn/
3% Ag/.5% Cu
Solder Crimp
Specify
LEAD
STYLE
from
chart
–S
=30μ" (0,76μm)
Gold on contact area,
Tin on solder tail
(–11 & –14 only)
–H
=30μ" (0,76μm)
Gold on contact area,
Gold Flash
on solder tail
(–07 only)
–K
=(20,00mm) 0.80"
DIA Polyimide
film Pick &
Place Pad
–TR
=Tape & Reel
–GP
=Guide Post
(–23 only &
–07 only)
No. of positions x (2,16) .085 + (4,34) .171
(2,16) .085
(.050
DIA
(1,08) .0425
(.100
(2,54)
.100
No. of positions x (2,16) .085 + (2,95) .116
A
B
G1
02 01 G2 03 04
(.005
Perimeter
Signal Pairs (TYP)
(.050
A
LEAD
STYLE
–07.0
–11.0
–14.0
(6,66) .262
(10,72) .422
(13,66) .538
B
NO OF
ROWS
–8
–3
(24,59) .968
(11,89) .468
A
NO OF
ROWS
(23,32)
.918
(10,62)
.418
–8
–3
Fibre Channel
Rapid I/O
PCI Express
SATA
Infiniband
XAUI
MGT (Rocket I/O)
Download app notes at
www.samtec.com/appnote
Contact SIG @ samtec.com
for questions on protocols
Protocols
Supported
USABLE PAIRS
PER ARRAY*
48 Pairs
SIZE
104 Pairs
168 Pairs
18 Pairs
39 Pairs
63 Pairs
–08 x –8
–15 x –8
–23 x –8
–08 x –3
–15 x –3
–23 x –3
each row are grounded
PAIRS
PER ROW
OPTION
DPAF
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
–04, –06, –08,
–15, –23
–8
=Eight
Pair Rows
–3
=Three
Pair Rows
–H
=30μ" (0,76μm)
Gold on contact area,
Gold Flash on solder tail
–K
=(20,00mm)
0.80" DIA
Polyimide
film
Pick &
Place Pad
–TR
=Tape
& Reel
–2
= Lead-Free Tin Alloy
96.5% Sn/ 3%Ag/
.5% Cu
Solder Crimp
03.0
f
i
n
a
l
i
n
c
h
.
c
o
m
(.254
(.060
A
G2
03
01
02
G1
04
(1,27) .050
No. of positions x (2,16) .085 + (4,34) .171
Perimeter Grounds (TYP)
Solder crimped on tail
(.100
Pairs
(TYP)
(2,16) .085
(1,08) .0425
No. of positions x (2,16) .085 + (2,95) .116
(.050
DIA
(.005
(.050
Staggered pitch DPAM/DPAF
10mm Stack Height
Differential Pair Signaling
Performance data for other stack heights and complete
test data available at www.samtec.comDPAM,
www.samtec.comDPAF or contact sig@samtec.com
Rated @ 3dB Insertion Loss
7.0 GHz / 14.0 Gbps
DPAM
LEAD
STYLE
–07.0
–11.0
–14.0
*Processing conditions will
affect mated height.
DPAF
MATED HEIGHT*
–03.0
10mm
14mm
17mm