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參數(shù)資料
| 型號(hào)： | DM3BT-DSF-PEJS |
| 元件分類(lèi)： | PCB用連接器 |
| 英文描述： | PCB CONNECTOR |
| 文件頁(yè)數(shù)： | 3/11頁(yè) |
| 文件大?。?/td> | 827K |
| 代理商： | DM3BT-DSF-PEJS |
11
DM3 Series
●microSD Card Connectors
● Refer to applicable Operation Manual listed below for additional precautions.
Series
DM3AT Series
DM3BT Series
DM3CS Series
DM3D Series
ETAD-F0345
ETAD-F0324
ETAD-F0335
ETAD-F0353
Operation Manual Number
■Recommended temperature profile
■Precautions
1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the
ejection mechanism and electrical performance of the connector
2. Do not apply excessive force to the connector when handling or after installation on the PC board.
3. The connectors will reliably connect and operate with the correctly inserted microSDTM cards.
Follow the correct insertion / ejection procedure for the specific connector in use.
Attempts of incorrect insertion of the card may cause damage to the connector or the card.
4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in
the un-mounted connector.
5. Mounting on the Flexible Printed Circuit (FPC)
To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under
the FPC.
6. Small visible residual manufacturing fluids or tooling marks do not affect connector's performance.
7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on
the connector performance.
HRS test condition
Solder method
:Reflow, IR/hot air
Environment
:Room air
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number:M705-GRN360-K2-V)
Test board
:Glass epoxy 60mm∞100mm∞1.0mm thick
Metal mask
:0.12mm thick
Number of reflow cycles : 2cycles max.
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
Temperature
50
90 to 120 seconds
Preheating
50
seconds
Soldering
Time (Seconds)
()
100
150
200
250
150
200
230 min.
Peak:250 MAX
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DM3CS-SF | PCB CONNECTOR |
| DM3AT-SF-PEJ | PCB CONNECTOR |
| DM3C-SF | PCB CONNECTOR |
| DPX4MA-10P-10P-10P-8P-33-0001 | 38 CONTACT(S), MALE-MALE-MALE-MALE, MULTIWAY RACK AND PANEL CONN, PLUG |
| DPX4MA-10P-10P-10P-A10P-33-0001 | 40 CONTACT(S), MALE-MALE-MALE-MALE, MULTIWAY RACK AND PANEL CONN, PLUG |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DM3C-SF | 功能描述:記憶卡連接器 Micro SD Card M 8P 1.1mm Solder RA SM RoHS:否 制造商:Yamaichi Electronics 產(chǎn)品:Card Connectors 卡類(lèi)型:microSD 類(lèi)型: 節(jié)距: 方向: 安裝風(fēng)格:SMD/SMT 端接類(lèi)型: 排數(shù): 觸點(diǎn)數(shù)量: 電流額定值:0.5 A 電壓額定值:50 V |
| DM3C-SF(16) | 功能描述:記憶卡連接器 8P R/A SMT MICRO SD RoHS:否 制造商:Yamaichi Electronics 產(chǎn)品:Card Connectors 卡類(lèi)型:microSD 類(lèi)型: 節(jié)距: 方向: 安裝風(fēng)格:SMD/SMT 端接類(lèi)型: 排數(shù): 觸點(diǎn)數(shù)量: 電流額定值:0.5 A 電壓額定值:50 V |
| DM3CS-SF | 功能描述:記憶卡連接器 8P R/A SMT MICRO SD HINGE PUSH-PULL RoHS:否 制造商:Yamaichi Electronics 產(chǎn)品:Card Connectors 卡類(lèi)型:microSD 類(lèi)型: 節(jié)距: 方向: 安裝風(fēng)格:SMD/SMT 端接類(lèi)型: 排數(shù): 觸點(diǎn)數(shù)量: 電流額定值:0.5 A 電壓額定值:50 V |
| DM3D-SF | 功能描述:記憶卡連接器 MICRO SD CD CONN STD SMT PUSHPULL RoHS:否 制造商:Yamaichi Electronics 產(chǎn)品:Card Connectors 卡類(lèi)型:microSD 類(lèi)型: 節(jié)距: 方向: 安裝風(fēng)格:SMD/SMT 端接類(lèi)型: 排數(shù): 觸點(diǎn)數(shù)量: 電流額定值:0.5 A 電壓額定值:50 V |
| DM3D-SF(41) | 功能描述:記憶卡連接器 8P R/A SMT MICRO SD PUSH-PULL RoHS:否 制造商:Yamaichi Electronics 產(chǎn)品:Card Connectors 卡類(lèi)型:microSD 類(lèi)型: 節(jié)距: 方向: 安裝風(fēng)格:SMD/SMT 端接類(lèi)型: 排數(shù): 觸點(diǎn)數(shù)量: 電流額定值:0.5 A 電壓額定值:50 V |
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