FN7678.0 September 3, 2010 D2-24044 Package Outline Drawing M38.173C 38 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (HTSSOP) Rev 0" />
參數(shù)資料
型號: D2-24044-MR
廠商: Intersil
文件頁數(shù): 13/20頁
文件大?。?/td> 0K
描述: IC DGTL AMP AUDIO PWR D 38HTSSOP
標準包裝: 50
系列: D2Audio™
類型: D 類
輸出類型: 2-通道(立體聲)或 4 通道(四路)
在某負載時最大輸出功率 x 通道數(shù)量: 30W x 2 @ 8 歐姆
電源電壓: 9 V ~ 26 V
安裝類型: 表面貼裝
供應商設備封裝: 38-HTSSOP
封裝/外殼: 38-TFSOP (0.173",4.40mm 寬)裸露焊盤
包裝: 管件
20
FN7678.0
September 3, 2010
D2-24044
Package Outline Drawing
M38.173C
38 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (HTSSOP)
Rev 0, 4/10
NOTES:
EXPOSED PAD VIEW
DETAIL "A"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
9.70±0.10
1.10 MAX
0.50
0.09-0.20
0.05/0.15
38
PIN 1 ID
4
0.90±0.05
SEATING
PLANE
1
2
3
SEE
DETAIL "A"
0.10
D
A-B
C
0.20
CL
C
M
0.08
A-B
5
0.05
3
B
A
D
C
4.4±0.10
6.4
D
C
0.17-0.27
4
2X N/2 TIPS
0.25
H
0.6±0.10
LINE
PARTING
(1.00)
12 3
3.20±0.10
4.6±0.10
(0-8°)
(1.30)
(5.80)
(36X 0.50)
(38X 0.28)
(3.20)
(4.60)
SCALE: 30/1
(VIEW ROTATED 90°C.W.)
END VIEW
1. Die thickness allowable is 0.279±0.0127 (0.0110±0.0005 inches).
2. Dimensioning & tolerances per ASME. Y14.5m-1994.
3. Datum plane H located at mold parting line and coincident
with lead where lead exits plastic body at bottom of parting line.
4. At reference datum and does not include mold flash or protrusions,
and is measured at the bottom parting line. Mold flash or protrusions
shall not exceed 0.15mm on the package ends and 0.25mm between
5. The lead width dimension does not include dambar protrusion.
Allowable dambar protrusion shall be 0.07mm total in excess of
6. This part is compliant with JEDEC specification MO-153 variation BDT-1
the leads.
the lead width dimension at maximum material condition. Dambar
cannot be located on the lower radius or the foot. Minimum space
between protrusions and an adjacent lead should be 0.08mm.
(14°) TYP
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