參數(shù)資料
型號: CSPEMI400
英文描述: SIM Card EMI Filter Array with ESD Protection
中文描述: SIM卡EMI濾波器與ESD保護(hù)陣列
文件頁數(shù): 2/7頁
文件大小: 856K
代理商: CSPEMI400
2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
10/09/03
CSPEMI200A
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
A1
N.B.
No Bump – used for orientation / alignment
A2
MIC_IN2
Microphone Input 2 (from microphone)
A3
SPKR_OUT1
Speaker Output 1 (to speaker)
A4
SPKR_OUT2
Speaker Output 2 (to speaker)
B1
MIC_IN1
Microphone Input 1 (from microphone)
B2
ESD1
ESD Protection Input. Provides a channel specifically for ESD protection purposes.
B3
GND
Device Ground
B4
GND
Device Ground
C1
MIC_OUT1
Microphone Output 1 (to audio circuitry)
C2
MIC_OUT2
Microphone Output 2 (to audio circuitry)
C3
SPKR_IN1
Speaker Input 1 (from audio circuitry)
C4
SPKR_IN2
Speaker Input 2 (from audio circuitry)
MIC_IN2
A2
MIC_IN1
B1
SPKR_OUT1 SPKR_OUT2
A3
ESD1
B2
GND
B3
GND
B4
MIC_OUT1 MIC_OUT2
C1
SPKR_IN1
C3
SPKR_IN2
C4
Orientation
Marking
A4
C2
A1
200A
4
3
2
1
C
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
1) These drawings are not to scale.
TOP VIEW
(Bumps Down View)
CSPEMI200A
CSP Package
BOTTOM VIEW
(Bumps Up View)
2) Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
PART NUMBERING INFORMATION
Bumps
Package
Standard Finish
Lead-free Finish
2
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
11
CSP
CSPEMI200A
200A
CSPEMI200AG
200A
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