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參數(shù)資料
| 型號(hào)： | CS5381-KZZ |
| 廠商： | Cirrus Logic Inc |
| 文件頁數(shù)： | 2/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC AUD 120DB 192KHZ 24-TSSOP |
| 標(biāo)準(zhǔn)包裝： | 62 |
| 位數(shù)： | 24 |
| 采樣率（每秒）： | 216k |
| 數(shù)據(jù)接口： | 串行 |
| 轉(zhuǎn)換器數(shù)目： | 2 |
| 功率耗散（最大）： | 445mW |
| 電壓電源： | 模擬和數(shù)字 |
| 工作溫度： | -10°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-TSSOP |
| 包裝： | 管件 |
| 輸入數(shù)目和類型： | 2 個(gè)差分，單極 |
| 產(chǎn)品目錄頁面： | 755 (CN2011-ZH PDF) |
| 配用： | 598-1592-ND - REFERENCE DESIGN CS5381 AUD ADC 598-1008-ND - BOARD EVAL FOR CS5381 192KHZ ADC |
| 其它名稱： | 598-1092-5 |
IDT / ICS 3.3V, 2.5V LVPECL CLOCK GENERATOR
10
ICS843031AG-01 REV. A NOVEMBER 11, 2008
ICS843031-01
FEMTOCLOCKS CRYSTAL-TO-3.3V, 2.5V LVPECL CLOCK GENERATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843031-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843031-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 105mA = 363.8mW
Power (outputs)
MAX
= 30mW/Loaded Output pair
Total Power
_MAX
(3.465V, with all outputs switching) = 363.8mW + 30mW = 393.8mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 90.5°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.394W * 90.5°C/W = 105.6°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 7. THERMAL RESISTANCE
θθθθθ
JA
FOR
8-PIN TSSOP, FORCED CONVECTION
θθθθθ
JA
by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
101.7°C/W
90.5°C/W
89.8°C/W
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