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參數(shù)資料
| 型號： | CS5205-3 |
| 廠商： | ZF Electronics Corporation |
| 英文描述： | 5A Adjustable, and 3.3V and 5V Fixed Linear Regulators |
| 中文描述： | 第5A可調(diào)和3.3V和5V固定線性穩(wěn)壓器 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大?。?/td> | 163K |
| 代理商： | CS5205-3 |
6
Applications Information: continued
The CS5205-X series of linear regulators includes thermal
shutdown and safe operating area circuitry to protect the
device. High power regulators such as these usually oper-
ate at high junction temperatures so it is important to cal-
culate the power dissipation and junction temperatures
accurately to ensure that an adequate heat sink is used.
The case is connected to V
OUT
on the CS5205-X, electrical
isolation may be required for some applications. Thermal
compound should always be used with high current regu-
lators such as these.
The thermal characteristics of an IC depend on the follow-
ing four factors:
1. Maximum Ambient Temperature T
A
(C)
2. Power dissipation P
D
(Watts)
3. Maximum junction temperature T
J
(C)
4. Thermal resistance junction to ambient R
Q
JA
(C/W)
These four are related by the equation
T
J
= T
A
+ P
D
′
R
Q
JA
(1)
The maximum ambient temperature and the power dissi-
pation are determined by the design while the maximum
junction temperature and the thermal resistance depend
on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
P
D(max)
={V
IN(max)
DV
OUT(min)
}I
OUT(max)
+V
IN(max)
I
Q
(2)
where
V
IN(max)
is the maximum input voltage,
V
OUT(min)
is the minimum output voltage,
I
OUT(max)
is the maximum output current, for the application
I
Q
is the maximum quiescent current at I
OUT
(max).
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment has a thermal resistance. Like series
electrical resistances, these resistances are summed to
determine R
Q
JA
, the total thermal resistance between the
junction and the surrounding air.
1. Thermal Resistance of the junction to case, R
Q
JC
(C/W)
2. Thermal Resistance of the case to Heat Sink, R
Q
CS
(C/W)
3. Thermal Resistance of the Heat Sink to the ambient air,
R
Q
SA
(C/W)
These are connected by the equation:
R
Q
JA
= R
Q
JC
+ R
Q
CS
+ R
Q
SA
(3)
The value for R
JA
is calculated using equation (3) and the
result can be substituted in equation (1).
The value for R
JC
is normally quoted as a single figure for
a given package type based on an average die size. For a
high current regulator such as the CS5205-X the majority of
the heat is generated in the power transistor section. The
value for R
SA
depends on the heat sink type, while R
CS
depends on factors such as package type, heat sink inter-
face (is an insulator and thermal grease used), and the
contact area between the heat sink and the package. Once
these calculations are complete, the maximum permissible
value of R
JA
can be calculated and the proper heat sink
selected. For further discussion on heat sink selection, see
application note òThermal Management for Linear
Regulators.ó
Calculating Power Dissipation and Heat Sink Requirements
C
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