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參數(shù)資料
| 型號： | CMP82C55AZ |
| 廠商： | Intersil |
| 文件頁數(shù)： | 10/26頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PROG PERIPHERAL INTFC 40-PDIP |
| 標(biāo)準(zhǔn)包裝： | 99 |
| 接口： | 總線 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 封裝/外殼： | 40-DIP（0.600"，15.24mm） |
| 供應(yīng)商設(shè)備封裝： | 40-DIP |
| 包裝： | 管件 |
| 安裝類型： | 通孔 |
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18
FN6140.2
June 15, 2006
Absolute Maximum Ratings TA = 25°C
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V
Input, Output or I/O Voltage . . . . . . . . . . . . GND-0.5V to VCC+0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to 5.5V
Operating Temperature Range
CMX82C55A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
IMX82C55A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
55
MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
62
PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . .
50
Maximum Storage Temperature Range . . . . . . . . . . -65°C to 150°C
Maximum Junction Temperature
Plastic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 Gates
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2.
θ
JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
VCC = 5.0V± 10%; TA = Operating Temperature Range
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VIH
Logical One Input Voltage
2.0
2.2
--
V
VIL
Logical Zero Input Voltage
-
0.8
V
VOH
Logical One Output Voltage
IOH = -2.5mA,
IOH = -100A
3.0
VCC -0.4
--
V
VOL
Logical Zero Output Voltage
IOL +2.5mA
-
0.4
V
II
Input Leakage Current
VIN = VCC or GND, RD, CS, A1, A0, RESET, WR
-1.0
-
+1.0
A
IO
I/O Pin Leakage Current
VO = VCC or GND, D0 - D7
-10
-
+10
A
IDAR
Darlington Drive Current
Ports A, B, C. Test Condition 3
-2.5
-
Notes 2, 4
mA
ICCSB
Standby Power Supply Current
VCC = 5.5V, VIN = VCC or GND. Output Open
-
10
A
ICCOP
Operating Power Supply Current
TA = +25°C, VCC = 5.0V, Typical (See Note 3)
-
1
-
mA/MHz
NOTES:
3. No internal current limiting exists on Port Outputs. A resistor must be added externally to limit the current.
4. ICCOP = 1mA/MHz of Peripheral Read/Write cycle time. (Example: 1.0
s I/O Read/Write cycle time = 1mA).
5. Tested as VOH at -2.5mA.
Capacitance TA = 25°C
SYMBOL
PARAMETER
TYPICAL
UNITS
TEST CONDITIONS
CIN
Input Capacitance
10
pF
FREQ = 1MHz, All Measurements are referenced to
device GND
CI/O
I/O Capacitance
20
pF
MS82C55A, MQ82C55A, MP82C55A
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