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參數(shù)資料
| 型號： | CMM2030-BD |
| 廠商： | MIMIX BROADBAND INC |
| 元件分類： | 放大器 |
| 英文描述： | 0.03 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | CHIP |
| 文件頁數(shù)： | 2/4頁 |
| 文件大小： | 279K |
| 代理商： | CMM2030-BD |
30 kHz-30 GHz GaAs MMIC
Optical Modulator Driver Amplifier
Page 2 of 4
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
CMM2030-BD
August 2006 - Rev 02-Aug-06
Absolute Maximum Ratings
g
n
R
r
e
m
a
r
a
P
V
V
m
1
7
3
3.0 W
+175°C
e
e
t
g
g
a
V
a
V
e
C
D
G
D
Continuous Power Dissipation
Channel Temperature
Storage Temperature
Mounting Temperature
r
w
o
P
p
n
A
-65°C to +175°C
+320°C
d
2
+
m
B
Die Attach and Bonding Procedures
Die Attach:
Eutectic die attach is recommended. For eutec-
tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1
min or less.
Wire Bonding:
Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding:
Stage Temperature: 250°C; Bond Tip Temperature: 150°C;
Bonding Tip Pressure: 18 to 40 gms depending on size of
wire.
Performance Optimization
Using the Gain-Ctl facility of the CMM2030-BD, out-
put power may be increased by application of 1.2 to 1.8 Volts
to the Bias Control pad. If the Gain-Ctl facility is not used, a
fixed voltage at the Bias Control pad can be implemented by
connecting a off-chip parallel resistor to the pad which will
lower the output voltage accordingly.
If Bias Control voltage is decreased further than those
lowest values given in the tables, both gain and output power
will start to drop.
Typical Performance
P1dB vs Frequency
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