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| 型號： | CLP270 |
| 英文描述： | OVERVOLTAGE AND OVERCURRENT PROTECTION FOR TELECOM LINE |
| 中文描述： | 過壓和過流保護(hù)的電信線路保護(hù) |
| 文件頁數(shù)： | 21/24頁 |
| 文件大?。?/td> | 368K |
| 代理商： | CLP270 |
CLP270M
21/24
Fig 37 :
Mounting on epoxy FR4 head dissipation by extending the area of the copper layer
Fig 38 :
Mounting on epoxy FR4 by using copper-filled through holes for heat transfer
FR4 board
Copper foil
FR4 board
Copper foil
heat transfer
heatsink
SUBSTRATES AND MOUNTING INFORMA-
TION
The use of epoxy FR4 boards is quite common for
surface mounting techniques, however, their poor
thermal conduction compromises the otherwise
outstanding
thermal
PowerSO-10. Some methods to overcome this
limitation are discussed below.
One possibility to improve the thermal conduction
is the use of large heat spreader areas at the
copper layer of the PC board. This leads to a
reduction of thermal resistance to 35 °C for 6 cm
2
of the board heatsink (see fig. 37).
Use of copper-filled through holes on conventional
FR4 techniques will increase the metallization and
performance
of
the
decrease thermal resistance accordingly. Using
a configuration with 16 holes under the spreader of
the package with a pitch of 1.8 mm and a diameter
of 0.7 mm, the thermal resistance (junction -
heatsink) can be reduced to 12°C/W (see fig. 38).
Beside the thermal advantage, this solution allows
multi-layer boards to be used. However, a
drawback of this traditional material prevent its use
in very high power, high current circuits. For
instance, it is not advisable to surface mount
devices with currents greater than 10 A on FR4
boards. A Power Mosfet or Schottky diode in a
surface mount
power package can handle up to
around 50 A if better substrates are used.
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| CLP270M | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:OVERVOLTAGE AND OVERCURRENT PROTECTION FOR TELECOM LINE |
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