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參數(shù)資料
| 型號(hào)： | CLA70000DP24 |
| 英文描述： | ASIC |
| 中文描述： | 專用集成電路 |
| 文件頁(yè)數(shù)： | 15/17頁(yè) |
| 文件大?。?/td> | 243K |
| 代理商： | CLA70000DP24 |
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KEY
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AVAILABLE ARRAY / PACKAGE COMBINATIONS.
70
71
72
73
74
75
76
77
78
GP44
1734
1734
GP52
1751
1710
GP64
1756
1756
1755
GP80
1733
1733
1643
1643
GP100
1644
1644
1644
GP120
1730
1730
1729
GP144
1758
GP160
1715
1715
70
71
72
73
74
75
76
77
78
GG44
1735
1735
GG52
1800
1800
GG64
1773
1773
1773
GG80
1740
1740
1740
1771
GG100
1675
1675
1675
GG120
1736
1736
1737
GG144
1770
GG160
1769*
1769
PLASTIC QUAD FLAT PACK (GP)
CERAMIC QUAD FLAT PACK (GG)
CLA70000 ARRAY PACKAGE GUIDE
PACKAGING
I
Wide range of surface mount and through board packages
I
Ceramic equivalents to most plastic packages - for fast prototyping
I
Ongoing commitment to new package development
Production quantities of the CLA70000 family are available in industry-standard ceramic and plastic packages according the
codes shown below. Prototype samples are normally supplied in ceramic only.
DC
DILMON
Dual in Line, Multilayer ceramic. Brazed leads Metal Sealed Lid. Through Board
DG
CERDIP
Dual In Line, Ceramic body, Alloy leadframe, Glass Sealed, Through Board
DP
PLASDIP
Dual In Line, Copper or Alloy leadframe, Plastic Moulded. Through Board
AC
P.G.A.
Pin Grid Array, Multilayer Ceramic. Metal Sealed lid. Through Board
AC (P)
POWER P.G.A.
As above with cavity down and Cu/W heat plate
MP
SMALL OUTLINE (S.O.)
Dual In Line, ’Gullwing’ Formed Leads. Plastic Moulded Surface Mount
LC
LCC
Leadless Chip Carrier. Multilayer Ceramic. Metal Sealed Lid. Surface Mount
HC
LEADED CHIP CARRIER
Quad Multilayer Ceramic. Brazed J Formed Leads. Metal Sealed Lid.
Surface Mount
Quad Multilayer Ceramic. Brazed Leads. Metal Sealed Lid. Surface Mount
GC
LEADED CHIP CARRIER
GC (P)
POWER LEADED CHIP CARRIER
As above with cavity down, and Cu/W heat plate
HG
QUAD CERPAC
Quad Ceramic Body, ‘J’ Formed Leads. Glass Sealed. Surface Mount.
GG
CERAMIC QUAD FLATPACK
Quad Ceramic Body, ‘Gullwing’ Formed Leads. Glass Sealed. Surface Mount.
HP
PLCC
Quad Plastic Leaded Chip Carrier. ‘J’ Formed Leads. Plastic Moulded.
Surface Mount
Plastic Quad Flat Pack. ‘Gullwing’ Formed Leads. Plastic Moulded. Surface Mount
GP
PQFP
PACKAGING OPTIONS
The package style and pin count information is intended only as a guide. Detailed package specification are available from GPS
Design Centers on request. Available packages are being continuously updated, so if a particular package is not listed, please
enquire through your GPS Sales Representative.
-
PROTOTYPES ONLY
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CLA70000DP28 | ASIC |
| CLA70000DP40 | ASIC |
| CLA70000DP48 | ASIC |
| CLA70000GG44 | ASIC |
| CLA70000GP44 | ASIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CLA70000DP28 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC |
| CLA70000DP40 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC |
| CLA70000DP48 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC |
| CLA70000GG44 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC |
| CLA70000GP44 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC |
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