參數(shù)資料
型號: C1210C101KARAC
廠商: KEMET Corporation
英文描述: Surface Mount Tip & Ring Ceramic Chip Capacitors
中文描述: 表面貼裝提示
文件頁數(shù): 2/3頁
文件大小: 106K
代理商: C1210C101KARAC
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
Marking
These chips are supplied unmarked. If required, they can be laser-marked as an extra cost option. Details on the
marking format are included in KEMET Surface Mount Catalog F3102 on page 96.
Soldering Process
The 0805 and 1206 sizes are suitable for either reflow or wave soldering. Sizes 1210 and larger should be limited
to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of pure nickel with an overplating
of pure tin for excellent solderability and resistance to leaching of the termination.
Packaging
KEMET High Voltage Surface Mount MLCC capacitors are available packaged in tape and reel configuration.
C
0805
C
103
K
A
R
A
C
Style
C - Ceramic
Size Code
0805, 1206, 1210, 1812, 1825, 2220, 2225
Specification
C - Standard
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
Capacitance Tolerance
J = ±5%, K = ±10%, M = ±20%
Voltage
A = 250V
Temperature Characteristic
Designated by Capacitance
Change over Temperature Range
R – X7R (±15%) (-55°C +125°C)
End Metallization
C = 100% Sn Std.
Failure Rate Level
A = Not Applicable
Capacitor Ordering Information
EIA Case Sizes
0805, 1206, 1210, 1812, 1825, 2220, 2225
Capacitance Range
0.001
μ
F to 1.2
μ
F
Test Parameters
Capacitance and Dissipation Factor measured at 1.0 ± 0.2 Vrms and 1.0 ± 0.2 kHz
Operating Temperature Range
-55°C to +125°C
Temperature Characteristic
-55°C to +125°C X7R: ±15% (0% VDC)
Capacitance Tolerances
J = ±5%, K = ±10%, M = ±20%
2.5%
Dissipation Factor
Aging Rate
2.5% per decade hour
Voltage Rating
250 VDC
1000M
Ω
μ
F or 100G
Ω
, whichever is less
25°C IR @ Rated Voltage
Dielectric Strength (DMV)
250% of Rated Voltage 5 ± 1 seconds and charge/discharge not exceeding 50mA
General Performance Characteristics & Electrical Parameters 250 VDC
Chip Size
T - Total Length
S - Separation
W - Pad Width
L - Pad Length
mm
in.
mm
in.
mm
in.
mm
in.
0805
3.30
0.130
0.70
0.028
1.60
0.063
1.30
0.051
1206
4.50
0.177
1.50
0.059
2.00
0.079
1.50
0.059
1210
4.50
0.177
1.50
0.059
2.90
0.114
1.50
0.059
1812
5.90
0.232
2.30
0.091
3.70
0.146
1.80
0.071
1825
5.90
0.232
2.30
0.091
6.90
0.272
1.80
0.071
2220
7.00
0.276
3.30
0.130
5.50
0.217
1.85
0.073
2225
7.00
0.276
3.30
0.130
6.80
0.268
1.85
0.073
Recommended Solder Pad Dimensions
相關PDF資料
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