參數(shù)資料
型號： C1206N75131G4C
廠商： KEMET Corporation
英文描述： CERAMIC CHIP CAPACITORS
中文描述： 陶瓷芯片電容器
文件頁數(shù)： 18/30頁
文件大小： 2058K
代理商： C1206N75131G4C
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP / HIGH VOLTAGE
C
0805
C
102
K
C
R
A
C
C - Ceramic
0805; 1206; 1210; 1808;
1812; 1825; 2220; 2225
Specification
C - Standard
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use
“
9
”
for 1.0 through 9.9 pF)
(Use
“
8
”
for 0.1 through .99 pF)
C = ±0.25pF*
D = ±0.5pF*
F = ±1%*
G = ±2%*
* Contact KEMET Sales for availability.
J = ±5%
K = ±10%
M = ±20%
G = 2000V
Z = 2500V
H = 3000V
C = 500V
D = 1000V
F = 1500V
Designated by Capacitance
Change over Temperature Range
G
–
(C0G) (±30ppm/C) (-55
°
C +125
°
C)
R
–
X7R (±15%) (-55
°
C +125
°
C)
End Metallization
C = Standard
Failure Rate Level
A = Not Applicable
CAPACITOR ORDERING INFORMATION
Property
Specification
Capacitance
C0G: 1 pF to 0.010 μF
X7R: 10pF
25
°
C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for
≤ 1000
pF (C0G only)
C0G: C*, D*, F*, G*, J, K, M * Contact KEMET Sales for availability.
X7R: J, K, M
C0G: 0.1% Max
X7R: 2.5% Max
500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V
Cap Tolerance
DF
Voltage Ratings
Operating Temperature Range
From -55C to +125C
100 G
or 1000 M
-μF, whichever is less
10 G
or 100 M
-μF, whichever is less
X7R: + 15%
C0G: + 30 ppm /
o
C
150% of Rated Voltage for Rated Voltage <1000 V
120% of Rated Voltage for Rated Voltage >=1000V
25
o
C IR @ 500V
125
o
C IR @ 500V
-55
o
C TCC
+125
o
C TCC
Dielectric Strength
Ripple Current
Consult KEMET Sales Representative
Electrical Parameters
ELECTRICAL PARAMETERS
MARKING
These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.
Details on the marking format is located on page 9
7
.
PACKAGING
KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk
bag as outlined on page 8
3
. Please consult factory for waffle packaging options.
Soldering Process
SOLDERING PROCESS
The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and
larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of
pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of
the termination.
RECOMMENDED SOLDER PAD DIMENSIONS
mm
3.30
4.50
4.50
5.90
5.90
5.90
7.00
7.00
in.
mm
0.70
1.50
1.50
2.30
2.30
2.30
3.30
3.30
in.
mm
1.60
2.00
2.90
2.40
3.70
6.90
5.50
6.80
in.
mm
1.30
1.50
1.50
1.80
1.80
1.80
1.85
1.85
in.
0805
1206
1210
1808
1812
1825
2220
2225
0.130
0.177
0.177
0.232
0.232
0.232
0.276
0.276
0.028
0.059
0.059
0.091
0.091
0.091
0.130
0.130
0.063
0.079
0.114
0.094
0.146
0.272
0.217
0.268
0.051
0.059
0.059
0.071
0.071
0.071
0.073
0.073
L (Pad Length)
Chip Size
T (Total Length)
S (Separation
W (Pad Width)
From -55oC to +125oC
Style
Chip Size
Capacitance Code, pF
Capacitance Tolerance
Voltage
Temperature Characteristic
8
4
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C1206N751F1GRC 功能描述:多層陶瓷電容器MLCC - SMD/SMT 750.PF 100V RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
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