參數(shù)資料
型號： C0805N62931G4C
廠商： KEMET Corporation
英文描述： CERAMIC CHIP CAPACITORS
中文描述： 陶瓷芯片電容器
文件頁數(shù)： 11/30頁
文件大小： 2058K
代理商： C0805N62931G4C
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP/CAPACITORS
Tin Lead L Termination
C 0805 C 103 K
5 R
A L*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF
J – ±5%
C – ±0.25pF
K – ±10%
D – ±0.5pF
M – ±20%
F – ±1%
G– ±2%
L #
W #
WIDTH
B
S
MOUNTING
TECHNIQUE
Solder Reflow
LENGTH
1.0 (.04) ± .05(.002)
BANDWIDTH
0.20 (0.008)-0.40 (0.016)
MIN. SEPARATION
0.3 (.012)
0.5 (.02) ± .05 (.002)
1.6 (.063) ± 0.15 (.006)
0.8 (.032) ± 0.15 (.006)
0.35 (.014) ±0.15 (.006)
0.7 (.028)
2.0 (.079) ± 0.2 (.008)
1.25 (.049) ± 0.2 (.008)
0.5 (.02) ±.25 (.010)
0.75 (.030)
Soldor
3.2 (.126) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
0.5 (.02) ±.25 (.010)
N/A
Solder Reflow
3.2 (.126) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
0.5 (.02) ±.25 (.010)
N/A
4.5 (.177) ± 0.3 (.012)
3.2 (.126) ± 0.3 (.012)
0.6 (.024) ±.35 (.014)
N/A
4.5 (.177) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
0.6 (.024) ±.35 (.014)
N/A
5.6 (.220) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
0.6 (.024) ±.35 (.014)
N/A
5.6 (.220) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
0.6 (.024) ±.35 (.014)
N/A
DIMENSIONS—MILLIMETERS AND (INCHES)
CAPACITOR ORDERING INFORMATION
CAPACITOR OUTLINE DRAWINGS
END METALLIZATION
L - SnPb plated nickel barrier
(SnPb 5% minimum)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P – X5R (±15%) (-55°C + 85°C)
VOLTAGE
1 - 100V
2 - 200V
5 - 50V
3 - 25V
4 - 16V
8 - 10V
9 - 6.3V
* Part Number Example: C0805C103K5RAL
Refer to pages
73-76
for NP0/C0G, X7R and X5R dielectric capacitance ranges available.
(14 digits - no spaces)
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 96.)
For extended value 1210 case size
– solder reflow only.
Solder
Reflow
METRIC
SIZE CODE
(Ref only)
1005
1608
2012
3216
3225
4532
4564
5650
5664
EIA
SIZE CODE
0402*
0603*
0805*
1206*
1210*
1812
1825*
2220
2225
(Standard Chips - For
Military see page 8
7
)
See page 7
8
for thickness
dimensions.
KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the
commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead elec-
troplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the
electronics industry marches to RoHS compliance it is important that KEMET provide the Tin/Lead terminated products for
our valued high reliability and military customers.
KEMET Tin/Lead MLCC surface mount capacitors are available in standard EIA case sizes from 0402 to 2225 and standard
KEMET Tiin/Lead MLCC surface mount capacitors are available in standard EIA case sizes from 0402 to 2225 and standard
capacitance values in X7R, X5R, C0G dielectrics. Voltage ratings range from 6.3V to 200V. To order the Tin/Lead termina-
tions indicate an “L” in the 14
th
digit of the part number. For additional dielectrics and voltage ratings please contact the fac-
tory or local Sales personnel.
FEATURES
Sn/Pb
77
C
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