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參數(shù)資料
| 型號： | BYG70 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Fast soft-recovery controlled avalanche rectifiers |
| 中文描述： | 快速軟恢復(fù)控制雪崩整流器 |
| 文件頁數(shù)： | 3/6頁 |
| 文件大?。?/td> | 35K |
| 代理商： | BYG70 |
1996 Jun 05
3
Philips Semiconductors
Preliminary specification
Fast soft-recovery
controlled avalanche rectifiers
BYG70 series
ELECTRICAL CHARACTERISTICS
T
j
= 25
°
C unless otherwise specified.
THERMAL CHARACTERISTICS
Notes
1.
2.
Device mounted on Al
2
O
3
printed-circuit board, 0.7 mm thick; thickness of copper
≥
35
μ
m, see Fig.7.
Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper
≥
40
μ
m, see Fig.7.
For more information please refer to the “General Part of associated Handbook”
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
F
forward voltage
I
F
= 1 A; T
j
= T
j max;
see Fig.5
I
F
= 1 A; see Fig.5
I
R
= 0.1 mA
2.1
3.6
V
V
V
(BR)R
reverse avalanche
breakdown voltage
BYG70D
BYG70G
BYG70J
reverse current
300
500
700
V
V
V
μ
A
I
R
V
R
= V
RRMmax
;
see Fig.6
V
R
= V
RRMmax
; T
j
= 165
°
C;
see Fig.6
when switched from I
F
= 0.5 A to
I
R
= 1 A; measured at I
R
= 0.25 A;
see Fig.8
V
R
= 0 V; f = 1 MHz
5
100
μ
A
t
rr
reverse recovery time
30
ns
C
d
diode capacitance
30
pF
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-tp
R
th j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
25
100
150
K/W
K/W
K/W
note 1
note 2
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| BYG70D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Fast soft-recovery controlled avalanche rectifiers |
| BYG70G | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Fast soft-recovery controlled avalanche rectifiers |
| BYG70J | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Fast soft-recovery controlled avalanche rectifiers |
| BYG70J/T3 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DIODE ULTRA FAST RECOVERY SMD |
| BYG70SERIES | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Fast soft-recovery controlled avalanche rectifiers |
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