參數(shù)資料
型號: BUF634UE4
英文描述: 250mA HIGH-SPEED BUFFER
中文描述: 250mA的高速緩沖
文件頁數(shù): 10/12頁
文件大小: 256K
代理商: BUF634UE4
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
DDPAK/
TO-263
DDPAK/
TO-263
DDPAK/
TO-263
DDPAK/
TO-263
DDPAK/
TO-263
PDIP
Package
Drawing
KTT
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
BUF634F
OBSOLETE
5
TBD
Call TI
Call TI
BUF634F/500
ACTIVE
KTT
5
500
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
CU SN
Level-2-260C-1 YEAR
BUF634F/500E3
ACTIVE
KTT
5
500
CU SN
Level-2-260C-1 YEAR
BUF634FKTTT
ACTIVE
KTT
5
50
CU SN
Level-2-260C-1 YEAR
BUF634FKTTTE3
ACTIVE
KTT
5
50
CU SN
Level-2-260C-1 YEAR
BUF634P
ACTIVE
P
8
50
CU NIPDAU
N / A for Pkg Type
BUF634PG4
ACTIVE
PDIP
P
8
50
CU NIPDAU
N / A for Pkg Type
BUF634T
ACTIVE
TO-220
KC
5
49
Call TI
N / A for Pkg Type
BUF634TG3
ACTIVE
TO-220
KC
5
49
Call TI
N / A for Pkg Type
BUF634U
ACTIVE
SOIC
D
8
100
CU NIPDAU
Level-3-260C-168 HR
BUF634U/2K5
ACTIVE
SOIC
D
8
2500
CU NIPDAU
Level-3-260C-168 HR
BUF634U/2K5E4
ACTIVE
SOIC
D
8
2500
CU NIPDAU
Level-3-260C-168 HR
BUF634UE4
ACTIVE
SOIC
D
8
100
CU NIPDAU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jan-2007
Addendum-Page 1
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