• 參數(shù)資料
    型號(hào): BUF05704AIPWP
    英文描述: 18 - V SUPPLY MULTI - CHANNER GAMMA CORRECTION BUFFER
    中文描述: 18 - V電源多- CHANNER伽瑪校正緩沖區(qū)
    文件頁(yè)數(shù): 21/25頁(yè)
    文件大?。?/td> 384K
    代理商: BUF05704AIPWP
    www.ti.com
    PowerPAD is a trademark of Texas Instruments
    PWP (RPDSOG20)
    THERMAL INFORMATION
    10
    1
    11
    20
    This PowerPAD package incorporates an exposed thermal pad that is designed to be attached directly to an
    external heatsink. When the thermal pad is soldered direct ly to the printed circuit board (PCB), the PCB can be
    used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to a
    ground plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer from
    the integrated circuit (IC).
    The exposed thermal pad dimensions for this package are shown in the following illustration.
    For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities,
    refer to Technical Brief,
    PowerPAD Thermally Enhanced Package
    , Texas Instruments Literature No. SLMA002
    and Application Brief,
    PowerPAD Made Easy
    , Texas Instruments Literature No. SLMA004. Both documents are
    available at www.ti.com.
    Exposed Thermal Pad Dimensions
    NOTE: All linear dimensions are in millimeters
    Top View
    PPTD027
    Exposed Thermal Pad
    3,70
    2,61
    2,40
    1,61
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