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參數(shù)資料
| 型號(hào)： | BU05MC |
| 英文描述： | COMMON MODE CHOKE COILS (FOR DC AND SIGNAL LINES) SMD TYPE |
| 中文描述： | 共模扼流線圈（區(qū)議會(huì)及信號(hào)線）SMD型 |
| 文件頁(yè)數(shù)： | 10/10頁(yè) |
| 文件大?。?/td> | 872K |
| 代理商： | BU05MC |
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399
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Technical considerations
Stages
Precautions
SMD Inductors
CM04RC
BU05MC
1.Circuit Design
2.PCB Design
3.Considerations for
automatic placement
4.Soldering
5.Cleaning
6.Handling
7.Storage conditions
Operating environment,
1.The products described in this specification are intended for
use in general electronic equipment,(office supply
equipment, telecommunications systems, measuring
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
Land pattern design
1.Please contact any of our offices for a land pattern, and refer
to a recommended land pattern of specifications.
Adjustment of mounting machine
1.Excessive impact load should not be imposed on the
products when mounting onto the PC boards.
2.Mounting and soldering conditions should be checked
beforehand.
Reflow soldering
1.Please contact any of our offices for a reflow soldering, and
refer to the recommended condition specified.
2.This products is reflow soldering only.
3.SMD Inductors
Please do not add any stress to a product until it returns in
normal temperature after reflow soldering.
Lead free soldering
1.When using products with lead free soldering, we request to
use them after confirming of adhesion, temperature of
resistance to soldering heat, soldering etc sufficiently.
Recommended conditions for using a soldering iron:
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
Cleaning conditions
1.SMD Inductors
Please contact any of our offices for a cleaning,
Handling
1.Keep the product away from all magnets and magnetic
objects.
Breakaway PC boards (splitting along perforations)
1.When splitting the PC board after mounting product, care
should be taken not to give any stresses of deflection or
twisting to the board.
2.Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1.Please do not give the product any excessive mechanical
shocks.
2.SMD Inductors
Please do not add any shock and power to a product in
transportation.
Pick-up pressure
1.SMD Inductors
Please do not push to add any pressure to a winding part.
Please do not give any shock and push into a ferrite core
exposure part.
Packing
1.SMD Inductors
Please avoid accumulation of a packing box as much as
possible.
Storage
1.To maintain the solderability of terminal electrodes and to
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled..
Recommended conditions
Ambient temperature
Humidity
Below 70% RH
The ambient temperature must be kept below 30
0
40
1. When installing products, care should be taken not to apply distortion stress as it may
deform the products.
1.If products are used beyond the range of the recommended conditions, heat stresses
may deform the products, and consequently degrade the reliability of the products.
1.There is a case that a characteristic varies with magnetic influence.
1.Planning pattern configurations and the position of products should be carefully
performed to minimize stress.
1.There is a case to be damaged by a mechanical shock.
2.SMD Inductors
There is a case to be broken by the handling in transportation.
1.SMD Inductors
Damage and a characteristic can vary with an excessive shock or stress.
1.There is a case that transformation and a product of tape are damaged by
accumulation of a packing box.
1. Under a high temperature and humidity environment, problems such as reduced
solderability caused by oxidation of terminal electrodes and deterioration
of taping/packaging materials may take place.
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