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AUTOMOTIVE 80C31BH/80C51BH/87C51
Table 2. Status of the External Pins During Idle and Power Down
Mode
Program
ALE
PSEN
PORT0
PORT1
PORT2
PORT3
Memory
Idle
Internal
1
Data
Idle
External
1
Float
Data
Address
Data
Power Down
Internal
0
Data
Power Down
External
0
Float
Data
NOTE:
For more detailed information on the reduced power modes refer to current Embedded Applications Handbook, and Applica-
tion Note AP-252, ``Designing with the 80C51BH.''
internal RAM in this event, but access to the port
pins is not inhibited. To eliminate the possibility of an
unexpected write to a port pin when Idle is terminat-
ed by reset, the instruction following the one that
invokes Idle should not be one that writes to a port
pin or to external memory.
POWER DOWN MODE
In the Power Down mode the oscillator is stopped,
and the instruction that invokes Power Down is the
last instruction executed. The on-chip RAM and
Special Function Registers retain their values until
the Power Down mode is terminated.
The only exit from Power Down is a hardware reset.
Reset redefines the SFRs but does not change the
on-chip RAM. The reset should not be activated be-
fore VCC is restored to its normal operating level and
must be held active long enough to allow the oscilla-
tor to restart and stabilize.
DESIGN CONSIDERATIONS
At power on, the voltage on VCC and RST must
come up at the same time for a proper start-up.
Before entering the Power Down mode the con-
tents of the Carry Bit and B.7 must be equal.
When the Idle mode is terminated by a hardware
reset, the device normally resumes program exe-
cution, from where it left off, up to two machine
cycles before the internal reset algorithm takes
control. On-chip hardware inhibits access to inter-
nal RAM in this event, but access to the port pins
in not inhibited. To eliminate the possibility of an
unexpected write when Idle is terminated by re-
set, the instruction following the one that invokes
Idle should not be one that writes to a port pin or
to external memory.
An external oscillator may encounter as much as
a 100 pF load at XTAL1 when it starts up. This is
due to interaction between the amplifier and its
feedback capacitance. Once the external signal
meets the VIL and VIH specifications the capaci-
tance will not exceed 20 pF.
For EPROM versions exposure to light when the
device is in operation may cause logic errors. For
this reason, it is suggested that an opaque label
be placed over the window when the die is ex-
posed to ambient light.
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