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參數(shù)資料
| 型號： | BCN31 |
| 廠商： | BI Technologies Corporation |
| 英文描述： | R/2R Ladder Network 8 Bit, 2512 Size Thick Film Leadless Chip Packages |
| 中文描述： | R/2R梯形網(wǎng)絡8位，2512尺寸厚膜無引線芯片封裝 |
| 文件頁數(shù)： | 2/4頁 |
| 文件大?。?/td> | 73K |
| 代理商： | BCN31 |
4-14
Model BCN31 Ladder
ENVIRONMENTAL
Moisture Resistance
High Temperature Operation
Short Time Overload
Temperature Cycling
Resistance to Solder Heat
Load Life
1,000 hours at +40°C, 95% R.H. (3.0%
R)
1,000 hours at 70°C (3.0%
R)
2.5 x rated voltage, 5 seconds (2.0%
R)
-55°C to +125°C, 5 cycles (1.0%
R)
260°C for 10 seconds (1.0%
R)
1,000 hours at 70°C (3.0%
R)
SCHEMATIC (Inch/mm)
R
10
9
8
7
6
1
2
3
4
5
2R
2R
2R
2R
2R
2R
2R
2R
2R
R R
R
R
R
R
SOLDER PAD LAYOUT (Inch/mm)
P
A
B
C
X
Y
A
B
C
X
Y
Wave Solder Process
Re-Flow Solder Process
C
P
Y
Y
A
X
X
B
.050
1.27
.084
2.10
.148
3.70
.014
0.35
.036
0.90
.032
0.80
.084
2.10
.148
3.70
.014
0.35
.036
0.90
.032
0.80
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| BCN318RB1000F7 | 制造商:TT Electronics / BI Technologies 功能描述:BCN318RB1000F7 |
| BCN318RB1001F7 | 制造商:TT Electronics / BI Technologies 功能描述:BCN318RB1001F7 |
| BCN318RB1002F7 | 制造商:TT Electronics / BI Technologies 功能描述:BCN318RB1002F7 |
| BCN318RB1003F7 | 制造商:TT Electronics / BI Technologies 功能描述:BCN318RB1003F7 |
| BCN318RB1004F7 | 制造商:TT Electronics / BI Technologies 功能描述:BCN318RB1004F7 |
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