參數(shù)資料
型號: BCN102RBI22J7
廠商: BI Technologies Corporation
英文描述: Thick Film Chip Resistor Arrays
中文描述: 厚膜晶片電阻陣列
文件頁數(shù): 9/10頁
文件大小: 138K
代理商: BCN102RBI22J7
4
4-13
Model BCN Series
SOLDER PAD LAYOUT (Inch/mm)
.026
0.65
.020
0.50
.044
1.10
.085
2.15
P
Y
X1
L
BCN 102
BCN 104
.020
0.50
.020
0.50
.018
0.45
.018
0.45
X
B
.059
1.50
.059
1.50
A
.020
0.50
.020
0.50
.010
0.25
NA
.031
0.80
.020
0.50
.193
4.90
.020
0.50
.012
0.30
P
Y
X
W
W2
.030
0.75
W3
W1
L
BCN 21
.030
0.75
.016
0.40
C
.016
0.40
B
.118
3.00
A
.059
1.50
X
1
X
P
P
Y
A B
Model BCN 104
Model BCN 102
Y
A B
W
1
W
3
P
L
W
2
A
Y
L
X
1
L
W
C
B
Model BCN 21
X
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相關代理商/技術參數(shù)
參數(shù)描述
BCN102RBI22KF7 制造商:BITECH 制造商全稱:Bi technologies 功能描述:Thick Film Chip Resistor Arrays
BCN102RBI22KJ7 制造商:BITECH 制造商全稱:Bi technologies 功能描述:Thick Film Chip Resistor Arrays
BCN102RBI270F7 制造商:BITECH 制造商全稱:Bi technologies 功能描述:Thick Film Chip Resistor Arrays
BCN102RBI270J7 制造商:BITECH 制造商全稱:Bi technologies 功能描述:Thick Film Chip Resistor Arrays
BCN102RBI270KF7 制造商:BITECH 制造商全稱:Bi technologies 功能描述:Thick Film Chip Resistor Arrays