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參數(shù)資料
| 型號： | B300W35A102XYG |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 5/15頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PROCESSOR AUDIO 24BIT 35WLCSP |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 系列： | BelaSigna® 300 |
| 類型： | 音頻處理器 |
| 應(yīng)用： | 便攜式設(shè)備 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 35-VFBGA，WLCSP |
| 供應(yīng)商設(shè)備封裝： | 35-WLCSP（3.63x2.68） |
| 包裝： | 帶卷 (TR) |
13
www.pericom.com
P-0.1
07/18/12
PI74AVC164245
16-Bit 1.2-2.5V to 3.3V Level Shifting Transceiver with 3-State Outputs
Pericom Semiconductor Corporation 1-800-435-2336
Packaging Mechanical: 48-Pin TSSOP (A)
1
.236
.244
.488
.496
.002
.006
SEATING PLANE
.007
.010
.0197
BSC
.004
.008
.319
1
48
12.4
12.6
6.0
6.2
0.50
0.17
0.27
8.1
0.05
0.15
0.09
0.20
X.XX
DENOTES DIMENSIONS
IN MILLIMETERS
.018
.030
0.45
0.75
.047
1.20 Max
BSC
DOCUMENT CONTROL NO.
PD - 1501
REVISION: G
DATE: 03/09/05
Note:
1. Controlling dimensions in millimeters.
2. Ref: JEDEC MO-153F/ED
3. Dimension does not include mold ash, protrusions or gate burrs. Mold ash, protru-
sions and gate burrs shall not exceed 0.15mm per side.
4. Dimension does not include interlead ash or protrusion. Interlead ash or protrusion
shall not exceed 0.25mm per side.
DESCRIPTION: 48-Pin 240-Mil Wide TSSOP
PACKAGE CODE: A
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 www.pericom.com
See Note 3
See Note 4
12-0208
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| B300W35A109XXG | 功能描述:IC PROCESSOR AUDIO 24BIT 35WLCSP 制造商:on semiconductor 系列:* 零件狀態(tài):有效 標(biāo)準(zhǔn)包裝:2,500 |
| B3011 | 制造商:HAKKO Corporation 功能描述: |
| B3011RW | 制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Compact 1 x 2 Inch 30W Wide Input Range DC/DC Converters |
| B30-12 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:30WATTS - 12.5 VOLTS 150-175MHz |
| B30122-D1009-Q520 | 制造商:TDK Epcos 功能描述: |
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