參數(shù)資料
型號(hào): ATSAM3U4EA-CU
廠(chǎng)商: Atmel
文件頁(yè)數(shù): 50/60頁(yè)
文件大?。?/td> 0K
描述: IC MCU 32BIT 256KB FLSH 144LFBGA
產(chǎn)品培訓(xùn)模塊: MCU Product Line Introduction
Cortex®-M3 Introduction and Specific SAM3U Implementation
SAM3U Cortex-M3 Based MCU Introduction
Touch Solutions on the Atmel ARM? Cortex?-M3 Based Flash Microcontrollers
標(biāo)準(zhǔn)包裝: 184
系列: SAM3U
核心處理器: ARM? Cortex?-M3
芯體尺寸: 32-位
速度: 96MHz
連通性: EBI/EMI,I²C,MMC,SPI,SSC,UART/USART,USB
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,DMA,I²S,POR,PWM,WDT
輸入/輸出數(shù): 96
程序存儲(chǔ)器容量: 256KB(256K x 8)
程序存儲(chǔ)器類(lèi)型: 閃存
RAM 容量: 52K x 8
電壓 - 電源 (Vcc/Vdd): 1.62 V ~ 1.95 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b,8x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 144-LFBGA
包裝: 托盤(pán)
配用: ATSAM3U-EK-ND - KIT EVAL FOR AT91SAM3U CORTEX
54
6430FS–ATARM–10-Feb-12
SAM3U Series
Figure 13-3. 144-lead LQFP Package Drawing
Notes:
1. This drawing is for general information only; refer to JEDEe Drawing MS-026 for additional information.
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
4. b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between pro-
trusion and an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
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