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參數(shù)資料
| 型號： | ASM2I9940LG-32LT |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 9/10頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC CLK BUFFER 2:18 250MHZ 32LQFP |
| 標(biāo)準(zhǔn)包裝： | 250 |
| 類型： | 扇出緩沖器（分配） |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 2:18 |
| 差分 - 輸入:輸出： | 是/無 |
| 輸入： | LVCMOS，LVPECL |
| 輸出： | LVCMOS |
| 頻率 - 最大： | 250MHz |
| 電源電壓： | 2.375 V ~ 3.465 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-LQFP |
| 供應(yīng)商設(shè)備封裝： | 32-LQFP（7x7） |
| 包裝： | 托盤 |
ASM2I9940L
http://onsemi.com
8
Power Consumption of the ASM2I9940L and Thermal
Management
The ASM2I9940L AC specification is guaranteed for the
entire operating frequency range up to 250 MHz. The
ASM2I9940L power consumption and the associated
longterm reliability may decrease the maximum frequency
limit, depending on operating conditions such as clock
frequency, supply voltage, output loading, ambient
temperature, vertical convection and thermal conductivity
of package and board. This section describes the impact of
these parameters on the junction temperature and gives a
guideline to estimate the ASM2I9940L die junction
temperature and the associated device reliability.
Table 11. DIE JUNCTION TEMPERATURE AND
MTBF
Junction Temperature (°C)
MTBF (Years)
100
20.4
110
9.1
120
4.2
130
2.0
Increased power consumption will increase the die
junction temperature and impact the device reliability
(MTBF). According to the systemdefined tolerable MTBF,
the die junction temperature of the ASM2I9940L needs to be
controlled and the thermal impedance of the board/package
should be optimized. The power dissipated in the
ASM2I9940L is represented in Equation 1.
Where ICCQ is the static current consumption of the
ASM2I9940L, CPD is the power dissipation capacitance per
output, (M)
SCL represents the external capacitive output
load, N is the number of active outputs (N is always 12 in
case of the ASM2I9940L). The ASM2I9940L supports
driving transmission lines to maintain high signal integrity
and tight timing parameters. Any transmission line will hide
the lumped capacitive load at the end of the board trace,
therefore,
SCL is zero for controlled transmission line
systems and can be eliminated from Equation 1. Using
parallel termination output termination results in Equation 2
for power dissipation.
In Equation 2, P stands for the number of outputs with a
parallel or thevenin termination, VOL, IOL, VOH and IOH are
a function of the output termination technique and DCQ is
the clock signal duty cycle. If transmission lines are used
the use of controlled transmission line techniques eliminates
the impact of the lumped capacitive loads at the end lines and
greatly reduces the power dissipation of the device.
function of the power consumption.
Where Rqja is the thermal impedance of the package
(junctiontoambient) and TA is the ambient temperature.
According to Table 11, the junction temperature can be used
to estimate the longterm device reliability. Further,
operating frequency for the ASM2I9940L in a series
terminated transmission line system, Equation 4.
PTOT + ICCQ ) VCC @ fCLOCK @ N @ CPD ) S
M
CL
@ VCC
(eq. 1)
PTOT + VCC @ ICCQ ) VCC @ fCLOCK @ N @ CPD ) S
M
CL
)
S
P
DCQ @ IOH VCC * VOH ) 1 * DCQ @ IOL @ VOL
(eq. 2)
TJ + TA ) PTOT @ RqJA
(eq. 3)
fCLOCKMAX +
1
CPD @ N @ VCC 2
@
TJMAX * TA
RqJA
* ICCQ @ VCC
(eq. 4)
TJ,MAX should be selected according to the MTBF system
using 2S2P boards will result in a lower thermal impedance
than indicated below.
Table 12. THERMAL PACKAGE IMPEDANCE OF
THE 32LQFP
Convection,
LFPM
Rthja (1P2S
board), °C/W
Rthja (2P2S
board), °C/W
Still air
86
61
100 lfpm
76
56
200 lfpm
71
54
300 lfpm
68
53
400 lfpm
66
52
500 lfpm
60
49
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