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參數(shù)資料
| 型號(hào)： | ARF1518 |
| 元件分類(lèi)： | 功率晶體管 |
| 英文描述： | VHF BAND, Si, N-CHANNEL, RF POWER, MOSFET |
| 封裝： | CERAMIC PACKAGE-2 |
| 文件頁(yè)數(shù)： | 2/3頁(yè) |
| 文件大小： | 101K |
| 代理商： | ARF1518 |
050-4934
Rev
A
8-2005
DYNAMIC CHARACTERISTICS
ARF1518
Symbol
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
GS = 0V
V
DS = 200V
f = 1 MHz
V
GS = 15V
V
DD = 500V
I
D = 30A @ 25°C
R
G = 1.6
MIN
TYP
MAX
5400
6500
300
400
125
160
8
5
25
13
UNIT
pF
ns
FUNCTIONAL CHARACTERISTICS
Symbol
G
PS
η
ψ
Test Conditions
f = 27.12 MHz
V
GS = 0V
V
DD = 250V
Pout = 750W
No Degradation in Output Power
Characteristic
Common Source Amplifier Power Gain
Drain Efficiency
Electrical Ruggedness VSWR 10:1
MIN
TYP
MAX
15
17
70
75
UNIT
dB
%
1 Pulse Test: Pulse width < 380 S, Duty Cycle < 2%.
APT Reserves the right to change, without notice, the specifications and information contained herein.
Table 1 - Typical Class AB Large Signal Impedance -- ARF1501
F (MHz)
Zin ()ZOL ()
Zin - Gate shunted with 25 IDQ = 100mA
ZOL - Conjugate of optimum load for 750 Watts
output at Vdd = 250V
2.0
13.5
27
40
10.6 -j 12.2
0.5 -j 2.7
0.22 -j 2.7
0.2 +j .12
31 -j 4.7
15.6 -j 16
6.2 -j 12.6
3.1 -j 9.4
ARF1518
BeO
1525-100
1.000
.500
.150r
.500
.466
.750
1.500
1.250
.300
.200
.250
.005 .040
.125d
1
2
4
3
1 Drain
2 Source
3 Source
4 Gate
Thermal Considerations and Package
Mounting:
The rated 1350W power dissipation is only
available when the package mounting surface is
at 25
°C and the junction temperature is 200°C.
The thermal resistance between junctions and
case mounting surface is 0.12
°C/W. When instal-
led, an additional thermal impedance of 0.1
°C/W
between the package base and the mounting sur-
face is typical. Insure that the mounting surface
is smooth and flat. Thermal joint compound
must be used to reduce the effects of small sur-
face irregularities. The heatsink should incorpo-
rate a copper heat spreader to obtain best re-
sults. Use 4-40 or M3 screws torqued to 1.2 Nm.
HAZARDOUS MATERIAL WARNING
The ceramic portion of the device between
leads and mounting surface is beryllium oxide-
BeO. Beryllium oxide dust is toxic when in-
haled. Care must be taken during handling
and mounting to avoid damage to this area
These devices must never be thrown away
with general industrial or domestic waste.
D
S
G
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