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參數(shù)資料
| 型號(hào)： | ARF1502 |
| 元件分類： | 功率晶體管 |
| 英文描述： | VHF BAND, Si, N-CHANNEL, RF POWER, MOSFET |
| 文件頁(yè)數(shù)： | 2/2頁(yè) |
| 文件大?。?/td> | 114K |
| 代理商： | ARF1502 |
050-5600
R
ev
-
7-01
AD
VANCED
INFORMA
TION
DYNAMIC CHARACTERISTICS
ARF1502
Symbol
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
GS = 0V
V
DS = 50V
f = 1 MHz
V
GS = 15V
V
DD = 0.5 VDSS
I
D = ID[Cont.] @ 25°C
R
G = 1.6
MIN
TYP
MAX
4820
6000
800
1100
210
290
510
3.0
7
15
25
37
UNIT
pF
ns
FUNCTIONAL CHARACTERISTICS
Symbol
G
PS
η
ψ
Test Conditions
f = 27.12 MHz
V
GS = 0V
V
DD = 65V
Pout = 900W
No Degradation in Output Power
Characteristic
Common Source Amplifier Power Gain
Drain Efficiency
Electrical Ruggedness VSWR 10:1
MIN
TYP
MAX
15
17
70
75
UNIT
dB
%
1 Pulse Test: Pulse width < 380 S, Duty Cycle < 2%.
APT Reserves the right to change, without notice, the specifications and information contained herein.
D
S
G
S
D
G
S
ARF1500
BeO
135-05
.005
.045
.160
.500
1.065
.207
.375
.105 typ.
1.065
D
S
G
dims: inches
HAZARDOUS MATERIAL
WARNING
The ceramic portion of the
device
between
leads
and
mounting surface is beryllium
oxide.
Beryllium oxide dust is
highly toxic when inhaled. Care
must be taken during handling
and mounting to avoid damage
to this area.
These devices
must never be thrown away with
general industrial or domestic
waste.
;;
yy
ARF 1500
Compliant
layer
Clamp
;;;;
yyyy
Heat Sink
Thermal Considerations and Package Mounting:
The rated 1500W power dissipation is only available when the package mounting
surface is at 25C and the junction temperature is 200C. The thermal resistance
between junctions and case mounting surface is 0.12 C/W. When installed, an addi-
tional thermal impedance of 0.09 C/W between the package base and the mounting
surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint
compound must be used to reduce the effects of small surface irregularities. The heat-
sink should incorporate a copper heat spreader to obtain best results.
The package is designed to be clamped to a heatsink. A clamped joint maintains the
required mounting pressure while allowing for thermal expansion of both the device
and the heat sink. A simple clamp, a compliant layer of plastic or rubber, and two 6-32
(M3.5) screws can provide the minimum 85 lb required mounting force. T = 6 in-lb.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| ARF1505 | 制造商:Microsemi Corporation 功能描述:Trans RF MOSFET N-CH 1200V 25A 制造商:Microsemi Corporation 功能描述:RF MOSFET (VDMOS) - Bulk 制造商:Microsemi Corporation 功能描述:RF POWER TRANSISTOR MOSFET |
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| ARF1519 | 制造商:Microsemi Corporation 功能描述:RF MOSFET (VDMOS) - Bulk |
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