ProASICPLUS Flash Family FPGAs v5.9 2-1 General Description Routing Resources
參數(shù)資料
型號: APA150-FGG144
廠商: Microsemi SoC
文件頁數(shù): 13/178頁
文件大小: 0K
描述: IC FPGA PROASIC+ 150K 144-FBGA
標準包裝: 160
系列: ProASICPLUS
RAM 位總計: 36864
輸入/輸出數(shù): 100
門數(shù): 150000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 144-LBGA
供應商設(shè)備封裝: 144-FPBGA(13x13)
ProASICPLUS Flash Family FPGAs
v5.9
2-1
General Description
Routing Resources
The routing structure of ProASICPLUS devices is designed
to provide high performance through a flexible four-
level hierarchy of routing resources: ultra-fast local
resources, efficient long-line resources, high-speed, very
long-line
resources,
and
high
performance
global
networks.
The ultra-fast local resources are dedicated lines that
allow the output of each tile to connect directly to every
input of the eight surrounding tiles (Figure 2-1).
The efficient long-line resources provide routing for
longer distances and higher fanout connections. These
resources vary in length (spanning 1, 2, or 4 tiles), run
both vertically and horizontally, and cover the entire
ProASICPLUS device (Figure 2-2 on page 2-2). Each tile can
drive signals onto the efficient long-line resources, which
can in turn access every input of every tile. Active buffers
are inserted automatically by routing software to limit
the loading effects due to distance and fanout.
The high-speed, very long-line resources, which span the
entire device with minimal delay, are used to route very
long or very high fanout nets. (Figure 2-3 on page 2-3).
The high-performance global networks are low-skew,
high fanout nets that are accessible from external pins or
from internal logic (Figure 2-4 on page 2-4). These nets
are typically used to distribute clocks, resets, and other
high fanout nets requiring a minimum skew. The global
networks are implemented as clock trees, and signals can
be introduced at any junction. These can be employed
hierarchically with signals accessing every input on all
tiles.
Figure 2-1 Ultra-Fast Local Resources
L
Inputs
Output
Ultra-Fast
Local Lines
(connects a tile to the
adjacent tile, I/O buffer,
or memory block)
L
LL
相關(guān)PDF資料
PDF描述
APA150-FG144 IC FPGA PROASIC+ 150K 144-FBGA
AMM25DRSD-S288 CONN EDGECARD 50POS .156 EXTEND
RSA50DRMI CONN EDGECARD 100POS .125 SQ WW
RMA50DRMI CONN EDGECARD 100POS .125 SQ WW
HSM10DREF CONN EDGECARD 20POS .156 EYELET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
APA150-FGG144A 功能描述:IC FPGA PROASIC+ 150K 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設(shè)備封裝:256-FPBGA(17x17)
APA150-FGG144I 功能描述:IC FPGA PROASIC+ 150K 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設(shè)備封裝:484-FPBGA(27X27)
APA150-FGG256 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設(shè)備封裝:256-FPBGA(17x17)
APA150-FGG256A 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設(shè)備封裝:256-FPBGA(17x17)
APA150-FGG256I 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設(shè)備封裝:484-FPBGA(27X27)