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參數(shù)資料
| 型號： | AMMP-6232-BLKG |
| 元件分類： | 放大器 |
| 英文描述： | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 5 X 5 MM, 1.25 MM HEIGHT, LEAD FREE, SMT, 8 PIN |
| 文件頁數(shù)： | 8/9頁 |
| 文件大小： | 331K |
| 代理商： | AMMP-6232-BLKG |
8
Figure 23. Suggested Lead-Free Reow Prole for SnAgCu Solder Paste
Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder paste.
Please see recommended solder reow prole. Neither
Conductive epoxy or hand soldering is recommended.
x Apply solder paste using a stencil printer or dot
placement.
The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
x Follow solder paste and vendor’s recommendations
when developing a solder reow prole. A standard
prole will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
x Packages have been qualied to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
prole will not expose device beyond these limits.
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Temp
(
C)
Peak = 250 ± 5C
Ramp 1
Preheat Ramp 2
Reflow
Cooling
Melting point = 218C
A properly designed solder screen or stencil is required to
ensure optimum amount of solder paste is deposited onto
the PCB pads. The recommended stencil layout is shown
in Figure 22. The stencil has a solder paste deposition
opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly aect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required ne stencil outline.
The most commonly used solder reow method is
accomplished in a belt furnace using convection heat
transfer.
The suggested reow prole for automated
reow processes is shown in Figure 23. This prole is
designed to ensure reliable nished joints. However, the
prole indicated in Figure 1 will vary among dierent
solder pastes from dierent manufacturers and is shown
here for reference only.
AMMP-6232 Part Number Ordering Information
Part Number
Devices Per
Container
AMMP-6232-BLKG
10
Antistatic bag
AMMP-6232-TR1G
100
7” Reel
AMMP-6232-TR2G
500
7” Reel
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMMP-6232-TR2G | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6430-TR1G | 27000 MHz - 34000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6546-TR1G | 18000 MHz - 40000 MHz RF/MICROWAVE TRIPLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| AMMP-6546-TR2G | 18000 MHz - 40000 MHz RF/MICROWAVE TRIPLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| AMP-75+ | 5 MHz - 500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6232-TR1G | 功能描述:射頻放大器 18-32GHz Hi-Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6232-TR2G | 功能描述:射頻放大器 18-32GHz Hi-Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6233 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:18 to 32 GHz GaAs Low Noise Amplifier |
| AMMP-6233-BLKG | 功能描述:射頻放大器 LNA MMIC 18-31GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6233-TR1G | 功能描述:射頻放大器 LNA MMIC 18-31GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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