- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄64112 > AMMP-6231-TR2G 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER PDF資料下載
參數(shù)資料
| 型號： | AMMP-6231-TR2G |
| 元件分類： | 放大器 |
| 英文描述： | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 5 X 5 MM, LEAD FREE PACKAGE-8 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 567K |
| 代理商： | AMMP-6231-TR2G |
3
2
1
4
8
BACK VIEW
0.012 (0.30)
0.016 (0.40)
0.014 (0.365)
0.011 (0.28)
0.018 (0.46)
0.114 (2.90)
0.100 (2.54)
0.059
(1.5)
0.126
(3.2)
0.029 (0.75)
5
6
7
0.016 (0.40)
0.93 (2.36)
0.028 (0.70)
NOTES:
1.
* INDICATES PIN 1
2. DIMENSIONS ARE IN INCHES (MILLIMETERS)
3. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
SYMBOL
A
B
DIMENSIONS ARE IN INCHES (MM)
MIN.
0.198 (5.03)
0.0685 (1.74)
MAX.
0.213 (5.4)
0.088 (2.25)
DIMENSIONAL TOLERANCE FOR BACK VIEW: 0.002" (0.05 mm)
1
2
3
7
6
5
4
8
B
A
AMMP
XXXX
YWWDNN
FRONT VIEW
SIDE VIEW
*
Component Dimensions
Manual Assembly
Follow ESD precautions while handling packages.
Handling should be along the edges with tweezers.
Recommended attachment is conductive solder
paste. Please see recommended solder reflow profile.
Neither Conductive epoxy or hand soldering is recom-
mended.
Apply solder paste using a stencil printer or dot place-
ment. The volume of solder paste will be dependent
on PCB and component layout and should be con-
trolled to ensure consistent mechanical and electrical
performance.
Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tem-
perature to the pre-heat temp. to avoid damage due
to thermal shock.
Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 16. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat trans-
fer. The suggested reflow profile for automated reflow
processes is shown in Figure 17. This profile is designed
to ensure reliable finished joints. However, the profile
indicated in Figure 1 will vary among different solder
pastes from different manufacturers and is shown here
for reference only.
Figure 17. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Te
m
p
(C
)
Peak = 250 ± 5C
Ramp 1
Preheat Ramp 2 Reflow
Cooling
Melting point = 218C
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMMP-6231 | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6232-TR1G | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6232-BLKG | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6232-TR2G | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6430-TR1G | 27000 MHz - 34000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6232 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:18 TO 32 GHZ GAAS HIGH LINEARITY LNA IN SMT PACKAGE |
| AMMP-6232-BLKG | 功能描述:射頻放大器 18-32GHz Hi-Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6232-TR1G | 功能描述:射頻放大器 18-32GHz Hi-Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6232-TR2G | 功能描述:射頻放大器 18-32GHz Hi-Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6233 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:18 to 32 GHz GaAs Low Noise Amplifier |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。