參數(shù)資料
型號(hào)： AMMC-5024-W10
元件分類(lèi)： 放大器
英文描述： 0.03 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝： 0.0925 X 0.0413 INCH, 0.004 INCH HEIGHT, DIE
文件頁(yè)數(shù)： 10/10頁(yè)
文件大?。?/td> 361K
代理商： AMMC-5024-W10
9
Figure 19. AMMC-5024 Schematic.
GND
Drain Bias
(Vdd)
Nine Identical
Vdd AUX
Second Gate
First Gate
Bias (Vg1)
RF_Input
DET_OUT
RF_Output
DET_BIAS
DET_REF
Assembly Techniques
ThebacksideoftheMMICchipisRFground.Formicrostrip
applicationsthechipshouldbeattacheddirectlytothe
groundplane(e.g.circuitcarrierorheatsink)usingelectri-
callyconductiveepoxy[1,2].
Forbestperformance,thetopsideoftheMMICshouldbe
broughtuptothesameheightasthecircuitsurrounding
it.Thiscanbeaccomplishedbymountingagoldplated
metalshim(samelengthastheMMIC)underthechip
whichisofcorrectthicknesstomakethechipandadja-
centcircuitthesameheight.Theamountofepoxyused
forthechiporshimattachmentshouldbejustenoughto
provideathinfilletaroundthebottomperimeterofthe
chip.Thegroundplaneshouldbefreeofanyresiduethat
mayjeopardizeelectricalormechanicalattachment.
RFconnectionsshouldbekeptasshortasreasonableto
minimizeperformancedegradationduetoundesirable
seriesinductance.Asinglebondwireisnormallysuf-
ficientforsingleconnections,howeverdoublebonding
with0.7milgoldwirewillreduceseriesinductance.Gold
thermo-sonicwedgebondingisthepreferredmethod
forwireattachmenttothebondpads.Therecommended
wirebondstagetemperatureis150°c±2°c.
CautionshouldbetakentonotexceedtheAbsoluteMaxi-
mumRatingforassemblytemperatureandtime.
Thechipis100umthickandshouldbehandledwithcare.
ThisMMIChasexposedairbridgesonthetopsurfaceand
shouldbehandledbytheedgesorwithacustomcollet
(donotpickupthediewithavacuumondiecenter).
Bondingpadsandchipbacksidemetallizationaregold.
ThisMMICisalsostaticsensitiveandESDprecautions
shouldbetaken.Eutecticattachisnotrecommendedand
mayjeopardizereliabilityofthedevice.
FormoredetailedinformationseeAvagoTechnologies’
ApplicationNote#5359“GaAsMMICassemblyandhan-
dlingguidelines”.
Notes:
1. Ablebond84-1LMlsilverepoxyisrecommended
2.Eutecticattachisnotrecommendedandmayjeopardizereliability
ofthedevice
相關(guān)PDF資料
PDF描述
AMMC-5024 0.03 MHz - 40000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMC-5024 0.03 MHz - 40000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMC-5026 2000 MHz - 35000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMC-5026 2000 MHz - 35000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMC-5033-W10 17700 MHz - 32000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AMMC-5024-W50 功能描述:射頻放大器 Amplifier GaAs MMIC TWA RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類(lèi)型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel
AMMC-5025-W10 功能描述:射頻放大器 Amplifier GaAs MMIC TWA RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類(lèi)型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel
AMMC-5025-W50 功能描述:射頻放大器 Amplifier GaAs MMIC TWA RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類(lèi)型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel
AMMC-5026 制造商:AVAGO 制造商全稱(chēng):AVAGO TECHNOLOGIES LIMITED 功能描述:2-35 GHz GaAs MMIC Traveling Wave Amplifier
AMMC-5026_08 制造商:AVAGO 制造商全稱(chēng):AVAGO TECHNOLOGIES LIMITED 功能描述:2-35 GHz GaAs MMIC Traveling Wave Amplifier
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