• 參數(shù)資料
    型號: AM70PDL129CDH85I
    廠商: Spansion Inc.
    英文描述: Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
    中文描述: 堆疊式多芯片封裝(MCP / XIP)的快閃記憶體,數(shù)據(jù)存儲的MirrorBit閃存和移動存儲芯片(XIP)的
    文件頁數(shù): 47/127頁
    文件大?。?/td> 846K
    代理商: AM70PDL129CDH85I
    November 24, 2003
    Am70PDL127CDH/Am70PDL129CDH
    45
    A D V A N C E I N F O R M A T I O N
    Table 14.
    Device Geometry Definition
    Addresses
    Data
    Description
    27h
    0018h
    Device Size = 2
    N
    byte
    28h
    29h
    0001h
    0000h
    Flash Device Interface description (refer to CFI publication 100)
    2Ah
    2Bh
    0000h
    0000h
    Max. number of byte in multi-byte write = 2
    N
    (00h = not supported)
    2Ch
    0003h
    Number of Erase Block Regions within device
    2Dh
    2Eh
    2Fh
    30h
    0007h
    0000h
    0020h
    0000h
    Erase Block Region 1 Information
    (refer to the CFI specification or CFI publication 100)
    31h
    32h
    33h
    34h
    00FDh
    0000h
    0000h
    0001h
    Erase Block Region 2 Information
    (refer to the CFI specification or CFI publication 100)
    35h
    36h
    37h
    38h
    0007h
    0000h
    0020h
    0000h
    Erase Block Region 3 Information
    (refer to the CFI specification or CFI publication 100)
    39h
    3Ah
    3Bh
    3Ch
    0000h
    0000h
    0000h
    0000h
    Erase Block Region 4 Information
    (refer to the CFI specification or CFI publication 100)
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