參數(shù)資料
型號(hào): AM49PDL127BH66IS
廠商: SPANSION LLC
元件分類(lèi): 存儲(chǔ)器
英文描述: 128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2 M x 16-Bit) CMOS
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 8 X 11.60 MM, FBGA-73
文件頁(yè)數(shù): 85/86頁(yè)
文件大小: 588K
代理商: AM49PDL127BH66IS
December 16, 2003
Am49PDL127BH/Am49PDL129BH
83
A D V A N C E I N F O R M A T I O N
PHYSICAL DIMENSIONS
TLA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm
10
INDEX MARK
73X
C
0.15
(2X)
(2X)
C
0.15
B
A
6
b
0.20
C
C
C
C
0.15 M
0.08
M
A B
D
E
PIN A1
CORNER
C
TOP VIEW
SIDE VIEW
A2
A1
A
0.08
BOTTOM VIEW
10
9
7
6
8
4
3
1
2
5
A
B
C
D
F
E
G
H
J
K
L
M
eD
CORNER
E1
7
SE
D1
eE
SD
PIN A1
7
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX IN THE "D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX IN THE "E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
6.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7.
SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = E/2
8.
"+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9.
NOT USED.
10. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
PACKAGE
TLA 073
JEDEC
N/A
11.60 mm X 8.00 mm PACKAGE
NOTE
SYMBOL
MIN.
NOM.
MAX.
A
---
---
1.20
PROFILE
A1
0.20
---
---
BALL HEIGHT
A2
0.81
---
0.97
BODY THICKNESS
D
11.60 BSC
BODY SIZE
E
8.00 BSC
BODY SIZE
D1
8.80 BSC
MATRIX FOOTPRINT
E1
7.20 BSC
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
73
BALL COUNT
Ob
0.33
---
0.43
BALL DIAMETER
eE
0.80 BSC
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD/SE
0.40 BSC
SOLDER BALL PLACEMENT
A2,A3,A4,A5,A6,A7,A8,A9
B2,B3,B4,B7,B8,B9
C2,C9,C10,D1,D10,E1,E10
F5,F6,G5,G6,H1,H10,J1,J10
K1,K2,K9,K10,L2,L3,L4,L7,L8,L9
M2,M3,M4,M5,M6,M7,M8,M9
DEPOPULATED SOLDER BALLS
w053003-163814c
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