參數(shù)資料
型號: AM42BDS640AGBD8IS
廠商: SPANSION LLC
元件分類: 存儲器
英文描述: RES 93.1K-OHM 0.1% 0.125W 50PPM THIN-FILM SMD-1206 TR-7-PL ROHS
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA93
封裝: 8 X 11.60 MM, FBGA-93
文件頁數(shù): 62/72頁
文件大?。?/td> 1060K
代理商: AM42BDS640AGBD8IS
November 1, 2002
Am42BDS640AG
61
P R E L I M I N A R Y
AC CHARACTERISTICS
Wait State Decoding Addresses:
A14, A13, A12 = “101”
5 programmed, 7 total
A14, A13, A12 = “100”
4 programmed, 6 total
A14, A13, A12 = “011”
3 programmed, 5 total
A14, A13, A12 = “010”
2 programmed, 4 total
A14, A13, A12 = “001”
1 programmed, 3 total
A14, A13, A12 = “000”
0 programmed, 2 total
Note:
Figure assumes address D0 is not at an address boundary, active clock edge is rising, and wait state is set to “101”.
Figure 32.
Example of Wait States Insertion (Standard Handshaking Device)
Data
AVD#
OE#
CLK
1
2
3
4
5
D0
D1
0
1
6
2
7
3
total number of clock cycles
following AVD# falling edge
Rising edge of next clock cycle
following last wait state triggers
next burst data
number of clock cycles
programmed
4
5
相關(guān)PDF資料
PDF描述
AM42BDS640AGBD8IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGTD9IS LJT 13C 13#22D SKT WALL RECP
AM42BDS640AGTD9IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42DL1624DB70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42DL1614DB70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM42BDS640AGBD8IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD9I 制造商:Spansion 功能描述:COMBO 4MX16 FALSH + 1MX16 SRAM 1.8V 93FBGA - Trays
AM42BDS640AGBD9IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD9IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGTC8IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only, Simultaneous Operation, Burst Mode Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM