參數(shù)資料
型號(hào): AM41DL6408G85IT
廠商: SPANSION LLC
元件分類(lèi): 存儲(chǔ)器
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 8 X 11.60 MM, FBGA-73
文件頁(yè)數(shù): 56/63頁(yè)
文件大小: 1139K
代理商: AM41DL6408G85IT
August 19, 2002
Am41DL6408G
55
P R E L I M I N A R Y
AC CHARACTERISTICS
Figure 29.
SRAM Read Cycle
Notes:
1. WE# = V
IH
, if CIOs is low, ignore UB#s/LB#s timing.
2. t
HZ
and t
OHZ
are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output
voltage levels.
3. At any given temperature and voltage condition, t
HZ
(Max.) is less than t
LZ
(Min.) both for a given device and from device to device
interconnection.
Data Valid
High-Z
t
RC
CE#1s
Address
OE#
Data Out
t
OH
t
AA
t
CO1
t
OE
t
OLZ
t
BLZ
t
LZ
t
OHZ
t
HZ
CE2s
t
CO2
相關(guān)PDF資料
PDF描述
AM41DL6408G Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408G70IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408G70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBC9IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGTC8IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM41DL6408H 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H70IS 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H70IT 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IS 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IT 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM